公开(公告)号：US20180102321A1

公开(公告)日：2018-04-12

申请号：US15724058

申请日：2017-10-03

Applicant: XINTEC INC.

Inventor： Yen-Shih HO ,  Po-Han LEE ,  Chia-Ming CHENG ,  Hsin-Yen LIN

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/498 ,  H01L23/495 ,  H01L23/00

Abstract: A chip package including a substrate having an upper surface, a lower surface, and a sidewall surface that is at the edge of the substrate is provided. The substrate includes a sensor device therein and adjacent to the upper surface thereof. The chip package further includes light-shielding layer disposed over the sidewall surface of the substrate and extends along the edge of the substrate to surround the sensor device. The chip package further includes a cover plate disposed over the upper surface of the substrate and a spacer layer disposed between the substrate and the cover plate. A method of forming the chip package is also provided.