Method and device for printing on heated substrates

    公开(公告)号:US10232655B2

    公开(公告)日:2019-03-19

    申请号:US15131195

    申请日:2016-04-18

    Applicant: XJET LTD.

    Abstract: A printing device for dispending material on a heated substrate is provided. The device may include a printing head having one or more nozzles and a heat shield that partially masks a side of the printing head that faces the heated substrate when printing so as to reduce heat transfer from the substrate to the printing head. The shield includes a slot aligned with the one or more nozzles to enable passage of material from the one or more nozzles to the heated substrate.

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