公开(公告)号：US20240238910A1

公开(公告)日：2024-07-18

申请号：US18449932

申请日：2023-08-15

申请人： Xiamen Jissyu Solder Paste Co., Ltd. ,  Xiamen University

发明人： Xuzhang ZHENG ,  Zhihao Zhang ,  Jixian Xing ,  Guangxin Wang ,  Shiqin Li

IPC分类号： B23K35/02 ,  B22F1/05 ,  B22F1/065 ,  B22F1/145 ,  B22F1/17

CPC分类号： B23K35/025 ,  B22F1/05 ,  B22F1/065 ,  B22F1/145 ,  B22F1/17 ,  B22F2301/10 ,  B22F2301/15 ,  B22F2301/255 ,  B22F2301/30 ,  B22F2304/10 ,  B22F2999/00

摘要： The present invention relates to a composite metal material and a low-temperature solder paste with high thermal conductivity containing the same. The composite metal material is a Cu core/Ag intermediate layer/Sn shell type metal powder (Cu@Ag@Sn) or a Cu core/Ni intermediate layer/Sn shell type metal powder (Cu@Ni@Sn) with a particle size of 20-60 μm. The low-temperature solder paste with high thermal conductivity is obtained by mixing the composite metal material with an Sn—Bi series alloy powder and a flux paste, can be used for welding of a variety of substrate, and is suitable for welding at a low temperature of lower than 150° C. The composite metal material of the present invention has a simple process, a low cost and high practicability, and poor heat dissipation and other problems of power devices after die bonding caused by low thermal conductivity of current solder pastes on the market are solved.