公开(公告)号：US08393527B2

公开(公告)日：2013-03-12

申请号：US13284957

申请日：2011-10-30

申请人： Xiang-Biao Chen ,  Li-Ping Fan ,  Xiao-Li Liu ,  Yu-Lin Liu

发明人： Xiang-Biao Chen ,  Li-Ping Fan ,  Xiao-Li Liu ,  Yu-Lin Liu

IPC分类号： B23K3/00 ,  B23K1/00 ,  B23K1/002

CPC分类号： B23K3/047 ,  B23K3/0478

摘要： A solder apparatus includes a platform, an operating mechanism, a solder member, a heater, and a control box module. The control box module includes a temperature controller and a temperature sensor. The temperature controller defines a predetermined temperature. The temperature sensor is capable of measuring the temperature of the solder member. The temperature controller has the heater heat the solder member when the measured temperature of the solder member is lower than or equal to the predetermined temperature, and has the heater stop heating the solder member, when the measured temperature of the solder member is higher than the predetermined temperature.

摘要翻译： 焊接装置包括平台，操作机构，焊接部件，加热器和控制箱模块。 控制箱模块包括温度控制器和温度传感器。 温度控制器定义预定温度。 温度传感器能够测量焊料的温度。 当焊料成分的测量温度低于或等于预定温度时，温度控制器使加热器加热焊料，并且当焊料成分的测量温度高于 预定温度。