公开(公告)号：US20150263443A1

公开(公告)日：2015-09-17

申请号：US14571862

申请日：2014-12-16

Applicant: Xiaomi Inc.

Inventor： Lin ZHANG ,  Yuan Gao ,  Gaocai Han

IPC: H01R12/72 ,  H01R24/58

CPC classification number: H01R12/72 ,  H01R12/7064 ,  H01R12/714 ,  H01R12/721 ,  H01R12/722 ,  H01R24/58

Abstract: An audio jack includes an insulated base including an upper plate and a lower plate connected to the upper plate, wherein a connecting portion between the upper plate and the lower plate forms a socket for plugging an audio plug, and a slot, formed between facing surfaces of the upper plate and the lower plate, is configured for installing a circuit board in a plugging manner; and a metal contact terminal configured to electrically connect the audio plug plugged into the socket to a corresponding conductive trace on the circuit board installed in the slot.

Abstract translation: 音频插座包括：绝缘基座，包括上板和连接到上板的下板，其中上板和下板之间的连接部分形成用于插入音频插头的插座和形成在相对表面之间的槽 上板和下板构成为以堵塞方式安装电路板; 以及金属接触端子，被配置为将插入插座中的音频插头电连接到安装在插槽中的电路板上的对应导电迹线。