DEVICE OF INSPECTING DEFECTS OF WAFER DICED OR ALIGNED

    公开(公告)号:US20250027885A1

    公开(公告)日:2025-01-23

    申请号:US18588491

    申请日:2024-02-27

    Inventor: Chien-Cheng CHEN

    Abstract: A device of inspecting defects of a wafer diced or aligned, the wafer including, after being diced or aligned, a silicon wafer layer and a blue film affixed to the bottom of the silicon wafer layer, the device including: an immersion liquid detector having a casing, the casing having a transparent lid, allowing a liquid to flow through and fill between the blue film and the transparent lid; a lens assembly disposed in the casing and below the transparent lid; an optical lens assembly disposed in the casing and below the lens assembly; a light source for generating visible light and infrared light; and a visible-light camera and an infrared camera, both adapted to perform imaging on the bottom of the silicon wafer layer.

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