MOLYBDENUM FILM ETCHANT COMPOSITION AND ETCHING METHOD USING SAME

    公开(公告)号:US20240417620A1

    公开(公告)日:2024-12-19

    申请号:US18814585

    申请日:2024-08-26

    Abstract: The present invention relates to an etchant composition for etching a molybdenum film and a modified molybdenum film while suppressing the etching of an aluminum oxide film and a silicon oxide film, and an etching method therefor, wherein the etchant composition comprises, with respect to the total weight of the composition: 0.1 to 10% by weight of inorganic acid; 0.001 to 5% by weight of an oxidizer; 0.001 to 3% by weight of a fluorine compound; 2 to 4% by weight of a pH adjusting agent; 0.0001 to 2% by weight of an additive; and a residual amount of water.

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