公开(公告)号：US06678911B2

公开(公告)日：2004-01-20

申请号：US09734480

申请日：2000-12-11

申请人： Frank Krupa ,  Yakov Epshteyn ,  Ellis Harvey

发明人： Frank Krupa ,  Yakov Epshteyn ,  Ellis Harvey

IPC分类号： B08B1102

CPC分类号： H01L21/67046 ,  B08B1/04

摘要： A multiple wafer cleaning apparatus comprising a first module (12), having a first spaced-apart brush assembly having an inner brush (21a) and an outer brush (22a), each brush having a brush pad (102) and a platen (103), and a second module (14) having a second spaced-apart brush assembly (22) having an inner brush (22a) and an outer brush (22b), each brush having a brush pad (102) and a platen (103), each pair of spaced-apart, opposing, vertically disposed brushes (21) and (22) for scrubbing vertically disposed semiconductor wafers (25), in tanks (28). The two modularized sets of motorized, rotating, opposed, pancake shaped brushes (12) and (14), grip the freely rotating wafers (25) causing the wafers (25) to rotate in the same direction as the brushes. The size of the brushes relative to the wafer radius is selected so that at any given instant a first portion of the offset vertically disposed wafers are positioned between the contacts of the brushes while the second remaining portion of the wafers extend outwardly downward from between the brushes. The peripheral second remaining portions of the wafers are supported by the vertical rotating support members (27). The tanks (28) can contain a cleaning solution (26) and a megasonic transducer (29) allowing the support member (27) to support the workpiece (25) in a partially submerged position.

摘要翻译： 一种多晶片清洁装置，包括具有第一间隔开的刷子组件的第一模块（12），其具有内刷（21a）和外刷（22a），每个刷具有刷垫（102）和压板（103） ）和具有具有内刷（22a）和外刷（22b）的第二间隔开的刷组件（22）的第二模块（14），每个刷具有刷垫（102）和压板（103） ，每对隔开的相对的垂直布置的刷子（21）和（22），用于在箱（28）中洗刷垂直布置的半导体晶片（25）。 电动的，旋转的，相对的，煎饼状的刷子（12）和（14）的两个模块化的组装夹着自由旋转的晶片（25），导致晶片（25）沿与刷子相同的方向旋转。 选择刷子相对于晶片半径的大小，使得在任何给定的时刻，偏移垂直设置的晶片的第一部分位于电刷的触点之间，而晶片的第二剩余部分从刷子之间向外向下延伸 。 晶片的周边第二剩余部分由垂直旋转支撑构件（27）支撑。 罐（28）可以包含清洁溶液（26）和兆声波换能器（29），允许支撑构件（27）以部分浸没的位置支撑工件（25）。

公开(公告)号：US06461441B1

公开(公告)日：2002-10-08

申请号：US09851866

申请日：2001-05-09

申请人： Yakov Epshteyn ,  Frank Krupa ,  Ellis Harvey

发明人： Yakov Epshteyn ,  Frank Krupa ,  Ellis Harvey

IPC分类号： B08B100

CPC分类号： H01L21/67046 ,  Y10S134/902

摘要： The cleaning pads (102, 104) that are used to clean work pieces (200), such as semiconductor wafers, are cyclically compressed against one another and rinsed with a rinsing fluid. By cyclically compressing the cleaning pads (102, 104) together and rinsing them, the debris that the cleaning pads remove from the work pieces (200) and that becomes embedded in, and adhered to, the cleaning pads (102, 104) is subsequently removed therefrom.

摘要翻译： 用于清洁诸如半导体晶片的工件（200）的清洁垫（102,104）彼此循环地压缩并用冲洗流体冲洗。 随后将清洁垫（102,104）周期性地压缩在一起并将其清洗，随后将清洁垫从工件（200）上移除并嵌入清洁垫（102,104）中并粘附到清洁垫（102,104）上的碎屑 从中移除。