摘要:
A solid electrolytic capacitor of this invention comprises an electrode provided with an anode lead; a dielectric oxide film, a solid electrolyte layer, a carbon layer, and a cathode layer, which are successively formed on the surface of the electrode; a positive terminal connected to the anode lead; and a negative terminal connected to the cathode layer by means of an electrically conductive adhesive; wherein at least one of the cathode layer and the electrically conductive adhesive comprises a polymer and an electrically conductive powder containing palladium. The capacitor displays little variation in the value of tan .delta. and slight changes in current leakage even when the capacitor is placed under conditions of high temperature and humidity. Moreover, electrical short-circuit failure of the capacitor rarely occurs.
摘要:
A chip-type solid electrolytic capacitor includes a cathode conductive layer provided on a whole surface of a cathode layer formed on an outer surface of a capacitor element, which whole surface is opposite to a surface where an anode lead wire is lead out, and on a surface adjacent to the first-mentioned whole surface. With this arrangement, if the capacitor element is obliquely inserted into a mold during the formation of a resin shell, the inner walls of the mold will not come into contact with cathode layer of the capacitor element, but will instead come into contact with the cathode conductive layer to prevent the cathode layer from being exposed to the resin shell. As a result, any possible damage to the cathode layer of the capacitor element when the peripheral surface of the resin shell on a cathode side is subjected to roughening is prevented to eliminate defects in electric characteristics such as leakage of electric current and a tan.delta. value.