TEMPERATURE INDUCED HEAD SKEW
    1.
    发明申请
    TEMPERATURE INDUCED HEAD SKEW 审中-公开
    温度感应头盔

    公开(公告)号:US20120044593A1

    公开(公告)日:2012-02-23

    申请号:US12860585

    申请日:2010-08-20

    IPC分类号: G11B27/36

    摘要: One way to minimize full DC head-skew re-calibrations rendered necessary by changes in storage media drive operating temperature is to compensate for temperature-induced DC head-skew using a known relationship between temperature-induced DC head-skew and storage media operating temperature. More specifically, a first DC head-skew is measured at a first arbitrary temperature of the storage media drive. A second DC head-skew is measured at a second arbitrary temperature of the storage media drive. A DC head-skew correction factor is calculated using the first and second DC head-skews at the first and second arbitrary temperatures. When a multi-head storage media drive is powered-up for operation, a temperature sensor located in the storage media drive assembly measures the current storage media drive temperature. The head-skew correction factor is applied based on the measured temperature to correct the DC head-skew.

    摘要翻译: 通过存储介质驱动器工作温度的变化使必要的全直流磁头偏移重新校准最小化的一种方法是使用温度引起的直流磁头偏移和存储介质工作温度之间的已知关系来补偿温度引起的直流磁头偏移 。 更具体地,在存储介质驱动器的第一任意温度下测量第一DC头偏移。 在存储介质驱动器的第二任意温度下测量第二DC头偏移。 使用第一和第二任意温度下的第一和第二DC头偏差来计算直流偏移校正系数。 当多头存储介质驱动器上电运行时,位于存储介质驱动器组件中的温度传感器测量当前的存储介质驱动器温度。 基于测量的温度应用头偏斜校正因子以校正DC头偏移。