公开(公告)号：US07304102B2

公开(公告)日：2007-12-04

申请号：US11007766

申请日：2004-12-07

申请人： Yongan Yan ,  Douglas Evan Meyers ,  Mark Allen Morris ,  D. Laurence Meixner ,  Satyabrata Raychaudhuri

发明人： Yongan Yan ,  Douglas Evan Meyers ,  Mark Allen Morris ,  D. Laurence Meixner ,  Satyabrata Raychaudhuri

IPC分类号： C08L63/00 ,  B32B27/04 ,  B32B27/20 ,  B32B27/38 ,  H01L21/56

CPC分类号： C08K3/40 ,  C08L63/00 ,  H01L23/293 ,  H01L2924/0002 ,  Y10T428/31511 ,  H01L2924/00

摘要： An encapsulant for use with opto-electronic devices and optical components incorporates a filler made from a glass that has been processed into particle form and heated to a predetermined temperature for a predetermined time, along with an epoxy having an index of refraction matched to that of the glass and heated to a predetermined temperature for a predetermined time, to prevent settling of the filler particles after mixing the filler particles with the epoxy, and thereby obtaining uniform dispersion of the particles within the epoxy. The encapsulant provides for high light transmittance, and its coefficient of thermal expansion can be varied by varying the amount of filler without substantially altering the optical properties of the encapsulant. The coefficient of thermal expansion variation within the encapsulant preferably is less than 30%, due to uniform dispersion of the filler particles within the epoxy.

摘要翻译： 用于光电器件和光学部件的密封剂包括由已经加工成颗粒形式并加热至预定温度预定时间的玻璃制成的填料，以及具有与 将玻璃加热至预定温度预定时间，以防止填料颗粒与环氧树脂混合后使填料颗粒沉降，从而获得颗粒在环氧树脂中的均匀分散。 密封剂提供高的透光率，并且其热膨胀系数可以通过改变填料的量而改变，而基本上不改变密封剂的光学性质。 由于填料颗粒在环氧树脂中的均匀分散，密封剂内的热膨胀变化系数优选小于30％。

公开(公告)号：US06841888B2

公开(公告)日：2005-01-11

申请号：US10455733

申请日：2003-06-04

申请人： Yongan Yan ,  Douglas Evan Meyers ,  Mark Allen Morris ,  D. Laurence Meixner ,  Satyabrata Raychaudhuri

发明人： Yongan Yan ,  Douglas Evan Meyers ,  Mark Allen Morris ,  D. Laurence Meixner ,  Satyabrata Raychaudhuri

IPC分类号： C08K3/40 ,  C08L63/00 ,  H01L23/29 ,  H01L31/0203 ,  H01L23/28

CPC分类号： C08K3/40 ,  C08L63/00 ,  H01L23/293 ,  H01L2924/0002 ,  Y10T428/31511 ,  H01L2924/00

摘要： An encapsulant for use with opto-electronic devices and optical components incorporates a filler made from a glass that has been processed into particle form and heated to a predetermined temperature for a predetermined time, along with an epoxy having an index of refraction matched to that of the glass and heated to a predetermined temperature for a predetermined time, to prevent settling of the filler particles after mixing the filler particles with the epoxy, and thereby obtaining uniform dispersion of the particles within the epoxy. The encapsulant provides for high light transmittance, and its coefficient of thermal expansion can be varied by varying the amount of filler without substantially altering the optical properties of the encapsulant. The coefficient of thermal expansion variation within the encapsulant preferably is less than 30%, due to uniform dispersion of the filler particles within the epoxy.

摘要翻译： 用于光电器件和光学部件的密封剂包括由已经加工成颗粒形式并加热至预定温度预定时间的玻璃制成的填料，以及具有与 将玻璃加热至预定温度预定时间，以防止填料颗粒与环氧树脂混合后使填料颗粒沉降，从而获得颗粒在环氧树脂中的均匀分散。 密封剂提供高的透光率，并且其热膨胀系数可以通过改变填料的量而改变，而基本上不改变密封剂的光学性质。 由于填料颗粒在环氧树脂中的均匀分散，密封剂内的热膨胀变化系数优选小于30％。