公开(公告)号：US20080107517A1

公开(公告)日：2008-05-08

申请号：US11960804

申请日：2007-12-20

申请人： Yoshiaki KOYAYASHI ,  Shigen Kobayashi ,  Kenji Tokunaga ,  Koji Kato ,  Teruo Minami

发明人： Yoshiaki KOYAYASHI ,  Shigen Kobayashi ,  Kenji Tokunaga ,  Koji Kato ,  Teruo Minami

IPC分类号： B65H1/00

CPC分类号： H01L21/67775 ,  H01L21/6735 ,  H01L21/67772

摘要： A method is provided of manufacturing semiconductor devices formed on a semiconductor wafer, including placing the wafer in a semiconductor container and conveying the container to a semiconductor manufacturing apparatus. An opening of the container is opposed to an opening of the apparatus such that an opener of the apparatus holds a lid of the opening the container. A key of the opener is inserted to a latch groove of the lid, and the key is rotated to contact a latch of the lid. The openings are connected such that a velocity differential pressure ratio obtained by dividing the maximum velocity when the opener holding the lid horizontally moves away from the opening of the container, by the differential pressure between the inside pressure and the outside pressure of the apparatus, is set to be 0.06 ((m/s)/Pa) or less, and then the wafer is processed.

摘要翻译： 提供一种制造形成在半导体晶片上的半导体器件的方法，包括将晶片放置在半导体容器中并将容器输送到半导体制造装置。 容器的开口与装置的开口相对，使得装置的开启器保持容器的开口盖。 开启器的钥匙被插入到盖的闩锁槽中，并且钥匙被旋转以接触盖的闩锁。 这些开口被连接成使得通过将保持盖的开启器水平地移动离开容器的开口的最大速度获得的速度差压比通过内部压力和设备的外部压力之间的压差来实现， 设定为0.06（（m / s）/ Pa）以下，然后处理晶片。