公开(公告)号：US20090223711A1

公开(公告)日：2009-09-10

申请号：US12283711

申请日：2008-09-15

申请人： Yoshikazu Ueno ,  Haruhiko Kondo ,  Harumi Kano ,  Misuru Obo ,  Akito Yoshii ,  Mashiro Kitamura ,  Hidenori Iida ,  Shin Teraki

发明人： Yoshikazu Ueno ,  Haruhiko Kondo ,  Harumi Kano ,  Misuru Obo ,  Akito Yoshii ,  Mashiro Kitamura ,  Hidenori Iida ,  Shin Teraki

IPC分类号： H05K9/00

CPC分类号： H05K9/0086 ,  H04N5/2252 ,  H04N5/2257 ,  Y10T29/49002

摘要： The objective of the present invention is to provide a shield method and shield material enabling to hold a flexibility degree with an enclosure shape and to make electronic component enclosures small and thin types. The shield method for electronic component enclosures in the present invention comprises a process in which a conductive layer is formed at a basic sheet and a shield sheet forming a non-hardening adhesive layer at the counter face to the basic layer is punched out to fit in individual electronic component enclosures for forming the shield materials, a process in which the shield material is attached to said electronic component enclosure, and a process in which a conductive adhesive is formed between a ground electrode set at said electronic component enclosure and the conductive layer to connect electrically.

摘要翻译： 本发明的目的是提供一种屏蔽方法和屏蔽材料，其能够保持具有外壳形状的柔性程度并使电子部件外壳成为小型和薄型。 本发明的电子部件外壳的屏蔽方法包括其中在基片上形成导电层的工艺，并且在与基层相对的面上形成非硬化粘合剂层的屏蔽片被冲压成适合 用于形成屏蔽材料的单个电子部件外壳，其中屏蔽材料附接到所述电子部件外壳的工艺，以及其中在所述电子部件外壳的接地电极和导电层之间形成导电粘合剂的工艺， 电连接。