公开(公告)号：US07361525B2

公开(公告)日：2008-04-22

申请号：US10530095

申请日：2003-11-14

申请人： Yoshiro Okada ,  Takahiko Ogo ,  Kaoru Sasaki

发明人： Yoshiro Okada ,  Takahiko Ogo ,  Kaoru Sasaki

IPC分类号： H01L21/00

CPC分类号： H01L27/14683 ,  H01L27/14623 ,  H01L27/14636 ,  H01L27/14685

摘要： A semiconductor integrated device comprises: a light-shielding film which shields at least some part of a transfer section of the semiconductor integrated device from light; a first wiring formed in the same layer as the light-shielding film, with one end connected to a pad electrode and an other end extended to a side edge of the semiconductor substrate; a second wiring arranged to go around a side face of the semiconductor substrate, and connected to the first wiring; and a sealing member which seals the solid-state image sensor.

摘要翻译： 半导体集成器件包括：遮光半导体集成器件的转印部分的至少一部分光的遮光膜; 形成在与所述遮光膜相同的层中的第一布线，其一端连接到焊盘电极，另一端延伸到所述半导体基板的侧边缘; 布置成绕着半导体衬底的侧面并连接到第一布线的第二布线; 以及密封固态图像传感器的密封构件。