公开(公告)号：US20120107436A1

公开(公告)日：2012-05-03

申请号：US13240045

申请日：2011-09-22

Applicant: Young-Jin HWANG

Inventor： Young-Jin HWANG

IPC: B29C65/78

CPC classification number: H01L21/565 ,  B29C45/0084 ,  B29C45/382 ,  B29C45/42 ,  B29C45/4225 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor package molding system includes a press unit, a loading apparatus for loading the first member and the first resin member on the first press apparatus and the second member and the second resin member on the second press apparatus, an unloading apparatus which is adapted to unload a molded first mold from the first press apparatus and a molded second mold from the second press apparatus, and a control unit which is adapted to apply a control signal to the press unit, the loading apparatus, and the unloading apparatus. The press unit includes at least one first press apparatus which is adapted to press a first resin member against a first member to mold a first mold, and at least one second press apparatus which is adapted to press a second resin member against a second member to mold a second mold.

Abstract translation: 一种半导体封装成型系统，包括压制单元，用于将第一构件和第一树脂构件装载在第一按压装置上的装载装置和第二压力装置上的第二构件和第二树脂构件，卸载装置， 从第一按压装置卸下模制的第一模具和来自第二冲压装置的模制的第二模具，以及适于向压制单元，装载装置和卸载装置施加控制信号的控制单元。 压榨单元包括至少一个第一压榨装置，其适于将第一树脂构件压靠第一构件以模制第一模具;以及至少一个第二压制装置，其适于将第二树脂构件压靠在第二构件上， 模制第二个模具。