公开(公告)号：US06697260B1

公开(公告)日：2004-02-24

申请号：US10040421

申请日：2001-10-29

申请人： Yu Ju Chen ,  Thomas J. Sleboda ,  Michael Zhong Xuan Wong ,  Hui Wu

发明人： Yu Ju Chen ,  Thomas J. Sleboda ,  Michael Zhong Xuan Wong ,  Hui Wu

IPC分类号： H05K500

CPC分类号： H05K5/0091

摘要： An integrated high-speed package comprising a package housing having a housing lip and connector having a center pin abutting along a bottom surface of the housing lip. For signal registration of a first substrate to the signal lead, the substrate is “floated” up to the housing lip, which provides an alignment reference to ensure that the top surface of the first substrate is aligned and in direct registration with the signal lead. In another embodiment, the center pin to substrate registration is provided at a top surface of a housing base. The housing base preferably comprises a first portion of a first height and a second portion of a second height. Accordingly, the housing base can accommodate substrates of different thickness while allowing a top surface of the first and a second substrate to be coplanar to facilitate signal registration there between.

摘要翻译： 一种集成的高速包装，包括具有壳体唇缘和连接器的封装壳体，所述壳体唇缘和连接器具有沿壳体唇缘的底表面邻接的中心销。 为了将第一衬底信号对准到信号引线，衬底“漂浮”到壳体唇缘，其提供对准参考，以确保第一衬底的顶表面对准并与信号引线直接对准。 在另一个实施例中，中心销到基板配准设置在壳体基座的顶表面处。 壳体基座优选地包括第一高度的第一部分和第二高度的第二部分。 因此，壳体基座可容纳不同厚度的衬底，同时允许第一和第二衬底的顶表面共面以促进其间的信号配准。