公开(公告)号：US20120242622A1

公开(公告)日：2012-09-27

申请号：US13253932

申请日：2011-10-05

申请人： Yu Tseng ,  Po-Fu Huang ,  Chang-Hsiao Lee

发明人： Yu Tseng ,  Po-Fu Huang ,  Chang-Hsiao Lee

IPC分类号： G06F3/042

CPC分类号： G06F3/0421 ,  G06F3/0425 ,  G06F3/0428

摘要： A touch module includes a panel device, an outer frame, and an optical sensor. The panel device includes an array substrate and a display panel having a touch surface. The array substrate is electrically connected to the display panel. The outer frame is disposed on the panel device. The optical sensor is disposed between the panel device and the outer frame, including a wire, at least one lens, a photosensitive chip, and a reflection mirror. The wire is formed on the array substrate. The lens is disposed between the display panel and the outer frame for guiding light transmitted from the touch surface. The photosensitive chip is electrically connected to one end of the wire. The reflection mirror is disposed above the photosensitive chip for reflecting the light guided by the lens to the photosensitive chip.

摘要翻译： 触摸模块包括面板装置，外框架和光学传感器。 面板装置包括阵列基板和具有触摸表面的显示面板。 阵列基板电连接到显示面板。 外框架设置在面板装置上。 光学传感器设置在面板装置和外框架之间，包括线，至少一个透镜，感光芯片和反射镜。 导线形成在阵列基板上。 透镜设置在显示面板和外框之间，用于引导从触摸表面传输的光。 感光芯片电连接到导线的一端。 反射镜设置在感光芯片上方，用于将由透镜引导的光反射到感光芯片。

公开(公告)号：US20060245606A1

公开(公告)日：2006-11-02

申请号：US11131969

申请日：2005-05-18

申请人： Yung Hsieh ,  Chuh Chen ,  Jen Feng ,  Yu Tseng

发明人： Yung Hsieh ,  Chuh Chen ,  Jen Feng ,  Yu Tseng

IPC分类号： H04R25/00

CPC分类号： H04R19/016

摘要： A microphone includes a housing, an acoustic port formed in the housing, a diaphragm disposed within the housing adjacent the acoustic port, a backplate assembly operably disposed within the housing in spaced relationship relative to the diaphragm and a circuit assembly disposed within the housing. A connecting member extends between the circuit assembly and the backplate assembly to secure mechanically the backplate assembly within the housing and to couple electrically the backplate assembly to the circuit assembly.

摘要翻译： 麦克风包括壳体，形成在壳体中的声学接口，邻近声学端口设置在壳体内的隔膜，可相对于隔膜以间隔开的关系可操作地设置在壳体内的背板组件和设置在壳体内的电路组件。 连接构件在电路组件和背板组件之间延伸，以将背板组件机械地固定在壳体内并且将背板组件电连接到电路组件。