公开(公告)号：US20100261337A1

公开(公告)日：2010-10-14

申请号：US12423486

申请日：2009-04-14

申请人： Yu-Chieh HUANG

发明人： Yu-Chieh HUANG

IPC分类号： H01L21/304

CPC分类号： H01L21/78 ,  H01L2224/27013 ,  H01L2224/83191

摘要： A method of manufacturing dies formed with a dielectric layer is revealed. A liquid dielectric layer is formed on the dicing tape. The liquid dielectric layer is heated to be sticky. Then, a wafer is attached to the dielectric layer on the dicing tape. The wafer is diced into a plurality of dies on the dicing tape. The dies with attached portions of the dielectric layer are picked up to be peeled and separated from the dicing tape. The implementation of the dicing tape can be expanded to resolve various issues such as wafer contaminations, wafer warpage due to multiple heating and mismatching of thermal expansion coefficients, and wafer singulating problems due to alignment difficulties. The wafer handling steps can further be reduced to increase processing yield and to enhance easy and better processing.

摘要翻译： 揭示了由电介质层形成的模具的制造方法。 在切割带上形成液体介质层。 将液体介电层加热粘稠。 然后，在切割带上的电介质层上附着晶片。 将晶片切割成切割带上的多个管芯。 拾取具有电介质层的附接部分的模具以从切割带剥离并分离。 可以扩展切割胶带的实现，以解决诸如晶片污染，由于多次加热引起的晶片翘曲和热膨胀系数失配的各种问题，以及由于对准困难而导致的晶片分离问题。 可以进一步减小晶片处理步骤以提高加工成品率，并且增强容易和更好的加工。