公开(公告)号：US20080105383A1

公开(公告)日：2008-05-08

申请号：US11962319

申请日：2007-12-21

申请人： Yuichi KUBO ,  Masateru OSADA ,  Masayuki AZUMA ,  Yasuyuki SAKAYA ,  Yuusuke ARAI ,  Tomohiro TAMAKI

发明人： Yuichi KUBO ,  Masateru OSADA ,  Masayuki AZUMA ,  Yasuyuki SAKAYA ,  Yuusuke ARAI ,  Tomohiro TAMAKI

IPC分类号： B32B38/18

CPC分类号： H01L21/6835 ,  H01L21/67132 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68336 ,  Y10T156/1702

摘要： An adhesive sheet (S) is expanded by an expanding mechanism (20) with a plate-like article (W) being mounted to a frame (F) after dicing of the plate-like article (W) to increase spacings between individual chips (T), an expanded state of the adhesive sheet (S) is maintained by an expansion maintaining device (10), so that the plate-like article (W) is able to be conveyed together with the frame (F) with the spacings between the chips (T) being maintained, thereby preventing adjacent chips (T) from interfering with each other during the conveyance. This allows the plate-like article (W), after the dicing, to be conveyed together with the frame (F) without edges of the adjacent chips (T) coming into contact with each other by vibration during the conveyance, thereby avoiding the causing of chipping or microcracks in the edges.

摘要翻译： 粘合片（S）通过扩张机构（20）膨胀，板状制品（W）在切割板状制品（W）之后安装到框架（F）上以增加单个芯片之间的间隔 T），通过膨胀维持装置（10）保持粘合片（S）的膨胀状态，使得板状制品（W）能够与框架（F）一起以 保持芯片（T），从而防止相邻的芯片（T）在传送期间相互干扰。 这样，在切割之后，板状物（W）能够与框架（F）一起被输送，相邻的切屑（T）的边缘在输送过程中通过振动而相互接触，从而避免了引起 在边缘处有碎裂或微裂纹。