公开(公告)号：US4846938A

公开(公告)日：1989-07-11

申请号：US218247

申请日：1988-07-13

申请人： Yuichi Tazaki ,  Osamu Ishigami ,  Akira Ichikawa ,  Daijyu Yoshino ,  Akira Soyama

发明人： Yuichi Tazaki ,  Osamu Ishigami ,  Akira Ichikawa ,  Daijyu Yoshino ,  Akira Soyama

IPC分类号： C25D1/08

CPC分类号： C25D1/08

摘要： An electrically conductive layer is formed on a surface of a model, and an organic solvent layer of an organic solvent which is inactive with respect to the conductive layer is formed on a surface of the conductive layer. Particles are then placed on the organic solvent layer to allow the particles to be partly melted by the organic solvent layer, and the organic solvent layer is removed to allow the particles to be adhered to the conductive layer. A metal layer is deposited on the model in an electroforming process to form an electroformed shell thinner than the diameter of the particles. The electroformed shell is separated from the model, and the particles are dissolved away from the electroformed shell with an organic solvent to produce an electroformed object having a number of vent apertures.

摘要翻译： 在模型的表面上形成导电层，并且在导电层的表面上形成有机溶剂相对于导电层无活性的有机溶剂层。 然后将颗粒置于有机溶剂层上，使颗粒部分地被有机溶剂层熔化，除去有机溶剂层，使颗粒粘附到导电层上。 金属层在电铸工艺中沉积在模型上以形成比颗粒直径更薄的电铸外壳。 将电铸壳与模型分离，并用有机溶剂将颗粒从电铸外壳溶解，以产生具有多个通气孔的电铸物体。