公开(公告)号：US20140023547A1

公开(公告)日：2014-01-23

申请号：US14009861

申请日：2012-04-06

申请人： Yutaka Mitooka ,  Makoto Hino ,  Koji Murakami ,  Hikaru Uchiyama ,  Yoshiaki Hashimoto

发明人： Yutaka Mitooka ,  Makoto Hino ,  Koji Murakami ,  Hikaru Uchiyama ,  Yoshiaki Hashimoto

IPC分类号： B22F1/00 ,  B22D23/06 ,  B22F3/02

CPC分类号： B22F1/0055 ,  B22D21/04 ,  B22D23/06 ,  B22F3/02 ,  C22C23/02 ,  Y10T428/2991

摘要： There is provided chips for injection molding wherein the surfaces of chips made of an aluminum-containing magnesium alloy are coated with carbon powder. A molded article produced by injection molding of such chips for injection molding had excellent bending properties and tensile strength, which vary in a small range. Furthermore, a scrap formed during injection-molding of the chips for injection molding has improved recyclability.

摘要翻译： 提供了用于注射成型的芯片，其中由含铝镁合金制成的芯片的表面涂覆有碳粉末。 通过注射成型这种用于注射成型的芯片制造的模制品具有优异的弯曲性能和拉伸强度，其在小范围内变化。 此外，在注射成型用芯片中形成的废料具有改善的可回收性。