公开(公告)号：US20190075679A1

公开(公告)日：2019-03-07

申请号：US15696852

申请日：2017-09-06

Applicant: ZIPPY TECHNOLOGY CORP.

Inventor： Chin-Wen CHOU ,  Yung-Hsin HUANG ,  Yu-Yuan CHANG ,  Chun-Lung SU ,  Yung-Feng CHIU ,  Chih-Hao CHEN

IPC: H05K7/20 ,  H05K5/02 ,  H05K7/18

Abstract: A power supply module with enhanced heat dissipation effect includes a rack including an opening and an accommodating room connected to the opening, as well as at least one power supply including a fitting section inserted from the opening while positioned within the accommodating room, and a heat dissipation section extending toward the outside of the opening from the opening, in which the power supply is formed in the heat dissipation section with a plurality of heat dissipation holes, in such a way that air is capable of entering the power supply from an output end to form heat convection together with the dissipation holes, so as to form a heat dissipation effect with respect to the power supply.