公开(公告)号：US20250107043A1

公开(公告)日：2025-03-27

申请号：US18730899

申请日：2023-02-13

Applicant: ZTE CORPORATION

Inventor： Zhen SUN ,  Xiaoxue CHEN ,  Zhiwei DUAN ,  Qingsong XU

IPC: H05K7/20

Abstract: Disclosed are a vapor chamber, a radiator and an electronic device. The vapor chamber includes: a bottom plate, a top plate, a side plate and a backflow piece. The bottom plate includes a first heat dissipation area and a second heat dissipation area provided at a peripheral side of the first heat dissipation area. The first heat dissipation area is provided with at least a first capillary structure layer on the side near the top plate, and the second heat dissipation area is provided with at least a second capillary structure layer on the side near the top plate. The capillary force of the first capillary structure layer is greater than that of the second capillary structure layer, and the flow resistance of the fluid medium in the second capillary structure layer is smaller than that in the first capillary structure layer.