BONDING ASSEMBLY
    1.
    发明申请
    BONDING ASSEMBLY 审中-公开
    连接总成

    公开(公告)号:US20150266219A1

    公开(公告)日:2015-09-24

    申请号:US14663832

    申请日:2015-03-20

    Applicant: Zephyros, Inc.

    CPC classification number: B60J1/007 B62D25/04 B62D25/06 B62D29/002 B62D29/005

    Abstract: A bonding assembly comprising a polymeric reinforcement member having a curved profile located into a corner of a frame so that the curved profile corresponds to a curve of the corner and the reinforcement member is located at an intersection of two or more frame members and one or more secondary materials is located onto or about the reinforcement member.

    Abstract translation: 一种接合组件,包括具有位于框架的角部中的弯曲轮廓的聚合物加强构件,使得弯曲轮廓对应于角部的弯曲并且加强构件位于两个或更多个框架构件和一个或多个框架构件的交叉点处 次级材料位于加强构件上或附近。

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