Pressure Sensor Module
    2.
    发明申请

    公开(公告)号:US20210055177A1

    公开(公告)日:2021-02-25

    申请号:US16316079

    申请日:2017-07-19

    申请人: ams AG

    IPC分类号: G01L9/00 B81C1/00

    摘要: A pressure sensor module comprises a base electrode surrounding at least a part of a bottom electrode, and an anchor arrangement on top of the base electrode comprising at least two electrically conductive walls that both surround at least a part of the bottom electrode. The pressure sensor module further comprises an electrically conductive layer that covers at least the bottom electrode and the anchor arrangement such that a cavity is formed between the bottom electrode, the anchor arrangement and the electrically conductive layer. The proportionate area of the electrically conductive walls in a cross section extending from the surface of the inner wall of the anchor arrangement facing the cavity to the surface of the outermost wall of the anchor arrangement facing away from the cavity in a plane parallel to the plane of the bottom electrode is equal to or less than 10%.

    CMOS-COMPATIBLE DEW POINT SENSOR DEVICE AND METHOD OF DETERMINING A DEW POINT

    公开(公告)号:US20190094164A1

    公开(公告)日:2019-03-28

    申请号:US16079080

    申请日:2017-02-21

    申请人: ams AG

    IPC分类号: G01N25/68

    摘要: The dew point sensor device comprises a semiconductor substrate (1), a Peltier element (2), which may be integrated in the substrate (1), a temperature sensor (3), a capacitor (4) at an exposed surface (9) above the substrate (1) and in the vicinity of the temperature sensor (3), and an electronic circuit (5), which may also be integrated in the substrate (1). The capacitor (4) comprises a plurality of capacitor elements (40) each having a capacitance, and the electronic circuit (5) is provided for an individual determination of the capacitances. The dew point is determined by a measurement of the variation of the capacitances at decreasing temperatures and a measurement of the relevant temperature.