公开(公告)号：US20220090283A1

公开(公告)日：2022-03-24

申请号：US17429470

申请日：2020-02-06

申请人： aveni

发明人： Vincent MEVELLEC ,  Louis CAILLARD ,  Mikaïlou THIAM ,  Dominique SUHR

IPC分类号： C25D3/56 ,  C25D3/58 ,  C25D5/50 ,  C25D7/12

摘要： Electrodeposition of a cobalt or copper alloy, and use in microelectronics The present invention relates to a process for fabricating cobalt or copper interconnects, and to an electrolyte enabling implementation of said process. The electrolyte, with a pH of less than 4.0, comprises cobalt or copper ions, chloride ions, manganese or zinc ions, and at most two organic additives of low molecular mass. One of these additives may be an alpha-hydroxy carboxylic acid.