公开(公告)号：US09423473B2

公开(公告)日：2016-08-23

申请号：US14606909

申请日：2015-01-27

Applicant: mCube Inc.

Inventor： Hong Wan ,  Anthony F. Flannery

IPC: G01R33/09 ,  G01R33/02

CPC classification number: G01R33/093 ,  G01R33/0206 ,  G01R33/096 ,  G01R33/098

Abstract: A method and structure for a three-axis magnetic field sensing device. An IC layer having first bond pads and second bond pads can be formed overlying a substrate/SOI member with a first, second, and third magnetic sensing element coupled the IC layer. One or more conductive cables can be formed to couple the first and second bond pads of the IC layer. A portion of the substrate member and IC layer can be removed to separate the first and second magnetic sensing elements on a first substrate member from the third sensing element on a second substrate member, and the third sensing element can be coupled to the side-wall of the first substrate member.