公开(公告)号：US20180323105A1

公开(公告)日：2018-11-08

申请号：US15957794

申请日：2018-04-19

申请人： pSemi Corporation

发明人： Vincent DeMaioribus ,  John James

IPC分类号： H01L21/78 ,  H01L21/683 ,  B26F3/00 ,  B28D1/22

CPC分类号： H01L21/78 ,  B26F3/002 ,  B28D1/225 ,  H01L21/6836

摘要： Improved methods and apparatuses for singulating integrated circuit (IC) dies that reduce or eliminate die collisions and work well with very small dies. Embodiments simultaneously separate dies in two dimensions by utilizing a break and expansion system that avoids die collisions by maintaining IC die separation after singulation. Singulation is achieved by placing the joined dies of the wafer substrate on a dicing tape, scoring the wafer substrate between the joined dies, and imposing a bending action by pressing a curved surface against the scored wafer substrate, which also expands the wafer substrate by stretching the dicing tape. After breaking, an inner expansion grip ring is pressed into an outer expansion grip ring in a nested configuration so as to maintain the stretched state of the dicing tape after the curved surface is fully removed, thereby maintaining the dicing tape in tension and the singulated die in spaced apart relation.