公开(公告)号：US20130319064A1

公开(公告)日：2013-12-05

申请号：US13488061

申请日：2012-06-04

申请人： Yi-Kun LIN

发明人： Yi-Kun LIN

IPC分类号： B23P15/26

CPC分类号： B23P15/26 ,  B23P2700/10 ,  F28F3/02 ,  H01L21/4871 ,  H01L23/367 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink fabrication method includes the step of heating aluminum billets into malleable aluminum and then extruding malleable aluminum into an aluminum substrate bar having different lengths of fins radially spaced around the periphery thereof, the step of using a machine to transversely cut the aluminum substrate bar into multiple aluminum substrates subject to a predetermined thickness, and the step of employing a stamping technique to stamp each aluminum substrate into a heat sink having radiation fins extended from and spaced around a plate-shaped base portion thereof.

摘要翻译： 散热器制造方法包括将铝坯加工成可延展的铝，然后将可延展的铝挤压成具有不同长度的翅片的铝基板的步骤，该铝基板具有围绕其周边径向间隔开的不同长度的翅片，使用机器横向切割铝基板 进入预定厚度的多个铝基板，并且采用冲压技术将每个铝基板压印成散热片的步骤，散热片具有从其板状基部延伸并间隔开的散热片。

公开(公告)号：US20140009884A1

公开(公告)日：2014-01-09

申请号：US13540954

申请日：2012-07-03

申请人： Hong-Long CHEN ,  Yi-Kun LIN

发明人： Hong-Long CHEN ,  Yi-Kun LIN

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling device includes a heat sink base plate for mounting on a circuit board to absorb waste heat from a heat source, a radiation fin unit consisting of a set of radiation fins, mounted on the heat sink base plate opposite to the circuit board and defining a plurality of heat-dissipation passages between each two adjacent ones of the radiation fins, a cooling fan unit mounted on the radiation fin unit for creating currents of air toward the heat-dissipation passages, a plurality of thermal tubes supported on the heat sink base plate and fastened to the radiation fins. Each radiation fin has first wind guiding wall portions and second wind guiding wall portions respectively tilted in reversed directions to facilitate the flow of air through the heat-dissipation passages.

摘要翻译： 冷却装置包括：散热器基板，用于安装在电路板上以吸收来自热源的废热;散热片单元，由一组辐射翅片组成，安装在与电路板相对的散热器底板上，并且限定 在两个相邻的辐射翅片之间的多个散热通道，安装在辐射翅片单元上用于产生朝向散热通道的空气流的冷却风扇单元，支撑在散热片基座上的多个热管 并固定在散热片上。 每个辐射翅片具有分别在相反方向上倾斜的第一导风壁部分和第二导风壁部分，以便于空气流过散热通道。

公开(公告)号：US08854819B2

公开(公告)日：2014-10-07

申请号：US13540954

申请日：2012-07-03

申请人： Hong-Long Chen ,  Yi-Kun Lin

发明人： Hong-Long Chen ,  Yi-Kun Lin

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling device includes a heat sink base plate for mounting on a circuit board to absorb waste heat from a heat source, a radiation fin unit consisting of a set of radiation fins, mounted on the heat sink base plate opposite to the circuit board and defining a plurality of heat-dissipation passages between each two adjacent ones of the radiation fins, a cooling fan unit mounted on the radiation fin unit for creating currents of air toward the heat-dissipation passages, a plurality of thermal tubes supported on the heat sink base plate and fastened to the radiation fins. Each radiation fin has first wind guiding wall portions and second wind guiding wall portions respectively tilted in reversed directions to facilitate the flow of air through the heat-dissipation passages.

摘要翻译： 冷却装置包括：散热器基板，用于安装在电路板上以吸收来自热源的废热;散热片单元，由一组辐射翅片组成，安装在与电路板相对的散热器底板上，并且限定 在两个相邻的辐射翅片之间的多个散热通道，安装在辐射翅片单元上用于产生朝向散热通道的空气流的冷却风扇单元，支撑在散热片基座上的多个热管 并固定在散热片上。 每个辐射翅片具有分别在相反方向上倾斜的第一导风壁部分和第二导风壁部分，以便于空气流过散热通道。