COOLING DEVICE FOR ELECTRONIC COMPONENTS
    1.
    发明申请
    COOLING DEVICE FOR ELECTRONIC COMPONENTS 审中-公开
    电子元件冷却装置

    公开(公告)号:US20110072835A1

    公开(公告)日:2011-03-31

    申请号:US12922392

    申请日:2009-03-04

    IPC分类号: F25B21/02

    CPC分类号: H05K7/20581 F25B21/02

    摘要: The refrigeration device for electronic components features a plate that is equipped on both sides with heat exchanger elements (22), along whose surface two separate air stream paths are disposed, of which one guides external air and one internal air. The refrigeration device features two intakes (15, 16), which lie in one plane, that are in a flow connection with two separated chambers (19, 20). Furthermore the two chambers are in an air stream connection by means of guiding plates (25, 26) with channels (23, 24) on the upper- and lower side of the plate.

    摘要翻译: 用于电子部件的制冷装置具有板,其两侧装有热交换器元件(22),沿其表面设置有两个分离的气流路径,其中一个引导外部空气和一个内部空气。 制冷装置具有位于一个平面中的两个入口(15,16),其与两个分离的室(19,20)处于流动连接。 此外,两个室通过在板的上侧和下侧具有通道(23,24)的引导板(25,26)处于空气流连接。