公开(公告)号：US12129338B2

公开(公告)日：2024-10-29

申请号：US16957345

申请日：2019-04-09

Applicant: LG CHEM, LTD.

Inventor： Changbo Shim ,  Seunghyun Song ,  Hwayeon Moon ,  Hyunsung Min ,  Hee Yong Shim

IPC: C08G73/12 ,  B32B5/26 ,  B32B7/027 ,  B32B7/12 ,  B32B15/08 ,  B32B15/14 ,  B32B15/20 ,  B32B27/38 ,  C08G59/56 ,  C08G59/68 ,  C08J5/24 ,  C08K3/36 ,  C08K5/5419 ,  C08K9/06 ,  C08L33/08 ,  C08L63/00 ,  C08L79/08 ,  H01L23/00 ,  H01L23/14 ,  H05K1/02 ,  H05K1/03

CPC classification number: C08G73/12 ,  B32B5/26 ,  B32B7/027 ,  B32B7/12 ,  B32B15/08 ,  B32B15/14 ,  B32B15/20 ,  B32B27/38 ,  C08G59/56 ,  C08G59/686 ,  C08J5/244 ,  C08J5/249 ,  C08K3/36 ,  C08K5/5419 ,  C08K9/06 ,  C08L33/08 ,  C08L63/00 ,  C08L79/08 ,  H01L23/145 ,  H01L23/562 ,  H05K1/0271 ,  H05K1/0373 ,  B32B2250/40 ,  B32B2260/021 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/734 ,  B32B2457/00 ,  B32B2457/14 ,  C08J2363/00 ,  C08J2433/08 ,  C08J2479/08 ,  C08K2201/003 ,  C08K2201/014 ,  C08L2205/025 ,  C08L2205/035 ,  H05K2201/068

Abstract: The present disclosure relates to a thermosetting resin composition for a semiconductor package including an amine compound containing a specific functional group, a thermosetting resin, a thermoplastic resin, and an inorganic filler, and having a glass transition temperature of 230° C. or less after curing, a prepreg including the thermosetting resin composition, and a metal clad laminate including the prepreg.

公开(公告)号：US20240327638A1

公开(公告)日：2024-10-03

申请号：US18742294

申请日：2024-06-13

Applicant: SOGANG UNIVERSITY RESEARCH & BUSINESS DEVELOPMENT FOUNDATION

Inventor： Jong Suk LEE ,  Hyun Jung YU ,  Ju Ho SHIN ,  Heseong AN

IPC: C08L79/08 ,  B01D53/22 ,  B01D67/00 ,  B01D71/64 ,  B01D71/70 ,  C08G73/10 ,  C08G77/26 ,  C08J5/18

CPC classification number: C08L79/08 ,  B01D53/228 ,  B01D67/0006 ,  B01D67/0083 ,  B01D71/64 ,  B01D71/70 ,  C08G73/1032 ,  C08G73/1042 ,  C08G73/1067 ,  C08G77/26 ,  C08J5/18 ,  B01D2323/08 ,  B01D2323/12 ,  B01D2323/30 ,  C08J2379/08 ,  C08J2483/08 ,  C08L2312/00

Abstract: A hybrid crosslinked polymeric membrane and a process for fabricating the same are provided. Specifically, the hybrid crosslinked polymer membrane comprises a glassy polymer and a ladder-structured polysilsesquioxane and has a crosslinked structure. The hybrid crosslinked polymer membrane can have an excellent permeability of carbon dioxide by virtue of an increase in the free volume and enhanced plasticization resistance, chemical resistance, and durability.

公开(公告)号：US12096641B2

公开(公告)日：2024-09-17

申请号：US17337707

申请日：2021-06-03

Applicant: Purdue Research Foundation

Inventor： Jianguo Mei ,  Aristide Gumyusenge

IPC: H01L51/05 ,  C08G73/10 ,  C08L79/08 ,  H10K10/46 ,  H10K85/10

CPC classification number: H10K10/471 ,  C08G73/1039 ,  C08L79/08 ,  H10K10/484 ,  H10K85/113

Abstract: A transistor device that includes a substrate comprising metallic gate contacts, a dielectric layer on the substrate comprising a polyimide or derivative thereof, a semiconductor layer on the dielectric layer comprising a semiconducting polymer confined in a host matrix material comprising a polyimide or derivative thereof, and source and drain contacts on the semiconductor layer.

公开(公告)号：US12072653B2

公开(公告)日：2024-08-27

申请号：US17828301

申请日：2022-05-31

Applicant: CANON KABUSHIKI KAISHA

Inventor： Akeshi Asaka ,  Yuma Kobayashi ,  Taiki Watanabe

IPC: G03G15/20 ,  B32B27/28 ,  C08L79/08 ,  C09D5/24 ,  C09D7/62 ,  C09D179/08

CPC classification number: G03G15/2057 ,  B32B27/281 ,  C08L79/08 ,  C09D5/24 ,  C09D7/62 ,  C09D179/08 ,  B32B2307/302 ,  B32B2433/00 ,  C08L79/08 ,  C08K3/041 ,  C08L81/06 ,  C08K9/08 ,  C08L79/08

Abstract: Provided is an electrophotographic belt having an endless shape including a base layer, wherein the base layer includes a polyimide film containing polyimide serving as a binder resin and a carbon nanotube, wherein the polyimide has an imidization ratio of 80% or more, wherein the carbon nanotube has at least one resin selected from the group consisting of: polyphenylsulfone; polysulfone; and polyethersulfone present on at least part of a surface thereof. The base layer has a tensile strength of 200 MPa or more in each of a peripheral direction thereof and a direction perpendicular to the peripheral direction.

公开(公告)号：US12065543B2

公开(公告)日：2024-08-20

申请号：US15733816

申请日：2020-01-28

Applicant: LG CHEM, LTD.

Inventor： Kyunghwan Kim ,  Chan Hyo Park

IPC: C08G73/10 ,  C08G73/14 ,  C08J5/18 ,  C08L79/08 ,  G02B1/04 ,  G02F1/1333

CPC classification number: C08G73/1067 ,  C08G73/1007 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1078 ,  C08G73/1082 ,  C08G73/14 ,  C08J5/18 ,  C08L79/08 ,  G02B1/04 ,  G02F1/133305 ,  C08J2379/08 ,  C08L2201/08 ,  C08L2203/16 ,  C08L2203/20 ,  C09K2323/00 ,  C09K2323/027 ,  G02F2202/022

Abstract: The present disclosure relates to a polyimide-based resin film which is synthesized by the reaction of an acid anhydride compound having a specific structure and a diamine compound, thereby capable of ensuring excellent optical properties even under high temperature heat treatment conditions, and stably maintaining optical properties even during further heat treatment, a substrate for display device, and an optical device using the same.

公开(公告)号：US11976178B2

公开(公告)日：2024-05-07

申请号：US15792349

申请日：2017-10-24

Applicant: THE BOEING COMPANY

Inventor： Patrick J. Kinlen

IPC: C08K7/06 ,  C01B32/174 ,  C01B32/194 ,  C01B32/21 ,  C08J5/06 ,  C08K3/04 ,  C08K9/04 ,  C09D5/08 ,  C09D7/62 ,  C23C30/00 ,  D01F11/12 ,  D01F11/14 ,  D01F11/16

CPC classification number: C08K7/06 ,  C01B32/174 ,  C01B32/194 ,  C01B32/21 ,  C08J5/06 ,  C08K3/04 ,  C08K9/04 ,  C09D5/08 ,  C09D5/082 ,  C09D5/084 ,  C09D7/62 ,  C23C30/00 ,  D01F11/127 ,  D01F11/14 ,  D01F11/16 ,  C08J2300/22 ,  C08J2300/24 ,  C08J2363/00 ,  C08J2365/00 ,  C08J2371/00 ,  C08J2379/08 ,  C08K9/04 ,  C08L63/00 ,  C08K9/04 ,  C08L79/08 ,  C08K9/04 ,  C08L61/16 ,  C08K9/04 ,  C08L79/085

Abstract: The present disclosure provides compositions including a carbon fiber material comprising one or more of an acyclic olefin group or a thiol disposed thereon; and a thermosetting polymer or a thermoplastic polymer. The present disclosure further provides metal substrates including a composition of the present disclosure disposed thereon. The present disclosure further provides vehicle components including a metal substrate of the present disclosure. The present disclosure further provides methods for manufacturing a vehicle component, including contacting a carbon fiber material with a carbon-containing zinc-titanium or a thiol to form a coated carbon fiber material; and mixing the coated carbon fiber material with a thermosetting polymer or a thermoplastic polymer to form a composition. Methods can further include depositing a composition of the present disclosure onto a metal substrate.

公开(公告)号：US20240084137A1

公开(公告)日：2024-03-14

申请号：US18266040

申请日：2021-03-19

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Dongliang LIU ,  Qing WANG ,  Junqi TANG ,  Jinchao DONG

IPC: C08L81/06 ,  C08K9/06 ,  C08L79/08

CPC classification number: C08L81/06 ,  C08K9/06 ,  C08L79/08 ,  C08K5/29

Abstract: Resin composition, resin adhesive film, and application thereof. The resin composition comprises the following components in parts by weight: 80-120 parts an epoxy resin, 1-20 parts a carbodiimide compound, 30-130 parts a phenolic resin, 20-250 parts a modified polymer, and 50-500 parts silicon dioxide; where the modified polymer is selected from a polyethersulfone or a polyamide-imide resin. By means of selection and compounding of components, the present resin composition has a uniquely advantageous film forming property, effectively solves the problem of a semi-cured resin adhesive film being prone to cracking or fracture, has outstanding heat resistance, a high glass transition temperature, a high modulus, good strength and toughness, and can to form a high strength stable bond with a metal film, has uniquely advantageous reliability, can amply satisfy printed circuit board and chip packaging performance requirements, and is suitable in a variety of chip packaging processes.

公开(公告)号：US20240076452A1

公开(公告)日：2024-03-07

申请号：US18233482

申请日：2023-08-14

Applicant: SK Innovation Co., Ltd.

Inventor： Hye Jin Park ,  Cheol Min Yun

IPC: C08G73/10 ,  C08L79/08 ,  E06B9/24 ,  G02F1/1333 ,  G02F1/153

CPC classification number: C08G73/1082 ,  C08L79/08 ,  E06B9/24 ,  G02F1/133305 ,  G02F1/153 ,  E06B2009/2464 ,  G02F2202/022

Abstract: A polyimide composition includes a polyimide precursor or a polyimide that includes structural units derived from a first monomer including a diamine-based compound and structural units derived from a second monomer including a cardo group-containing dianhydride-based compound. The cardo group-containing dianhydride-based compound is included in a range from 12 mol % to 20 mol % based on a total number of moles of the second monomer.

公开(公告)号：US11905431B2

公开(公告)日：2024-02-20

申请号：US17270006

申请日：2018-11-13

Applicant: PI ADVANCED MATERIALS CO., LTD.

Inventor： In Hwan Hwang ,  Ik Sang Lee ,  Jeong Yeul Choi

IPC: C09D179/08 ,  H01B3/30 ,  H01B13/06 ,  C08K5/092 ,  C08K5/521

CPC classification number: C09D179/08 ,  C08K5/092 ,  H01B3/306 ,  H01B13/06 ,  C08K5/521 ,  C08K5/521 ,  C08L79/08 ,  C08K5/5419 ,  C08L79/08 ,  C08K5/092 ,  C08L79/08

Abstract: The present invention is a polyimide varnish for conductor coating, which provides a polyimide varnish comprising: a polyamic acid solution prepared through polymerization of at least one dianhydride monomer and at least one diamine monomer in an organic solvent; an aromatic carboxylic acid having four or more carboxyl groups; an alkoxy silane coupling agent; and an antioxidant, wherein the polyimide varnish has a solid content of 15 to 38 wt % on the basis of the total weight thereof, and a viscosity at 23° C. of 500 to 9,000 cP, and the coated material prepared from the polyimide varnish has a degree of softening resistance of 520° C. or higher, and a breakdown voltage (BDV) of 8 kV/mm or higher.

公开(公告)号：US11866555B1

公开(公告)日：2024-01-09

申请号：US16543928

申请日：2019-08-19

Applicant: Energy, United States Department of

Inventor： David Hopkinson ,  Victor Armanda Kusuma ,  Surendar R. Venna ,  Joshua S. McNally ,  Christopher J. Orme ,  Frederick F. Stewart

IPC: B01D53/22 ,  C08G79/025 ,  C08L85/02 ,  C08K5/37 ,  C08K5/548 ,  C09B47/04 ,  C08L81/06 ,  C08L71/08 ,  B01D53/14 ,  B01D71/58 ,  C08L79/08

CPC classification number: C08G79/025 ,  B01D53/1475 ,  B01D71/58 ,  C08K5/37 ,  C08K5/548 ,  C08L71/08 ,  C08L79/08 ,  C08L81/06 ,  C08L85/02 ,  C09B47/04 ,  B01D2256/24 ,  B01D2257/504 ,  C08L2312/00

Abstract: The disclosed invention relates to a composition comprising a crosslinked blend of polyphosphazene polymers. The composition comprises a first polyphosphazene and a second polyphosphazene, where the first polyphosphazene and the second polyphosphazene being bound by a thiol bearing crosslinking agent. Such compositions are useful as a membrane material for the separation of gasses in a gaseous mixture.