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公开(公告)号:US06877250B2
公开(公告)日:2005-04-12
申请号:US10316218
申请日:2002-12-10
IPC分类号: H01L21/00 , H01L21/687 , F26B7/00 , B65B49/07
CPC分类号: H01L21/68764 , H01L21/67103 , H01L21/67109 , H01L21/67115 , H01L21/68771 , Y10S414/135 , Y10S414/141
摘要: In an apparatus for a treatment of a wafer at elevated temperatures, the wafer is taken out of the reactor after heat treatment with the help of a mechanical transport apparatus which preferably grips the wafer around the circumference and on the under side. The transport apparatus includes a wafer surrounding ring. The wafer is placed in a floating wafer reactor where it is cooled in a controlled manner. Transport for further action or treatment then takes place.
摘要翻译: 在用于在升高的温度下处理晶片的装置中,借助于优选地将晶片围绕圆周和下侧夹持的机械输送装置,将晶片热处理后从反应器中取出。 输送装置包括晶圆周围环。 将晶片放置在浮置晶片反应器中,在其中以受控的方式冷却晶片。 然后进行进一步行动或治疗的运输。