公开(公告)号：US06244788B1

公开(公告)日：2001-06-12

申请号：US09324380

申请日：1999-06-02

申请人： William Hernandez

发明人： William Hernandez

IPC分类号： B65G5350

CPC分类号： B23K3/0623 ,  B23K2101/36

摘要： An apparatus is provided for supplying solder balls to a receptacle. The apparatus includes a reservoir for storing the solder balls and a flow path. The flow path includes a first end connected to and in fluid communication with the reservoir and a second end for supplying the solder balls to the receptacle. The apparatus includes a flow actuator in fluid communication with the flow path to actuate the flow of the solder balls from the reservoir through the flow path to the receptacle. A trap is disposed in the flow path for trapping the solder balls and stopping the flow of the solder balls to the receptacle when the flow actuator is not actuated. Related methods are also disclosed.

摘要翻译： 提供一种用于将焊球供应到插座的装置。 该装置包括用于存储焊球和储存器的流路。 流动路径包括连接到储存器并与储存器流体连通的第一端和用于将焊球供给到容器的第二端。 该装置包括流动致动器，该流动致动器与流动路径流体连通，以使焊球从储存器通过流动路径致动到容器。 当流动致动器未致动时，在流动路径中设置陷阱以捕获焊球并阻止焊球的流动到容器。 还公开了相关方法。