公开(公告)号：US06255769B1

公开(公告)日：2001-07-03

申请号：US09608531

申请日：2000-06-30

Applicant: David A. Cathey ,  Charles M. Watkins

Inventor： David A. Cathey ,  Charles M. Watkins

IPC: H01J936

CPC classification number: H01J31/127 ,  H01J29/92 ,  H01J2329/92

Abstract: A field emission display with raised conductive features at bonding locations, and methods of forming the raised conductive features. In accordance with one embodiment of the invention, a plurality of applicators are arranged in a pattern corresponding to a pattern of bonding locations on either a baseplate or a faceplate of a field emission display. The bonding locations and respective applicators are aligned with each other, and then a predetermined quantity of a thick film conductive bonding material is deposited substantially simultaneously through each applicator onto each bonding location. The thick film conductive bonding material forms a conductive pad at each bonding location. The pads of thick film conductive bonding material are subsequently fired to form a raised feature at each bonding location.

Abstract translation: 在接合位置具有凸起导电特征的场发射显示器，以及形成凸起的导电特征的方法。 根据本发明的一个实施例，多个施加器以对应于场发射显示器的基板或面板上的接合位置的图案的图案布置。 接合位置和各个施加器彼此对准，然后将预定量的厚膜导电接合材料基本上同时通过每个涂布器沉积到每个接合位置上。 厚膜导电接合材料在每个接合位置形成导电焊盘。 随后在每个接合位置处烧制厚膜导电接合材料的焊盘以形成凸起的特征​​。