公开(公告)号：US06740968B2

公开(公告)日：2004-05-25

申请号：US10093740

申请日：2002-03-08

申请人： Toyotsugu Matsukura ,  Shinichi Sakai ,  Hisashi Morikawa

发明人： Toyotsugu Matsukura ,  Shinichi Sakai ,  Hisashi Morikawa

IPC分类号： H07L2310

CPC分类号： H01L23/4006 ,  H01L23/42 ,  H01L2924/0002 ,  H01L2924/00

摘要： Since the exposed collector part 32 of one semiconductor switching element 29 is attached to the heat radiating fin 42 by coating and filling a thermal conducting filler therebetween via spacers 33, 34 and 35, and the exposed collector part 37 of another semiconductor switching element 36 is directly attached to the same heat radiating fin 42 by coating the thermal conducting filler 41 thereto without any spacer, heat resulting from switching losses can be effectively transmitted to the heat radiating fin 42 and can be radiated therefrom. To effectively transmit heat, which results from switching losses, to a heat radiating fin and to radiate the same even if two semiconductor switching elements are connected in series, a collector part is exposed on the rear side thereof, and the two semiconductor switching elements are attached to a single heat radiating fin.

摘要翻译： 由于一个半导体开关元件29的暴露的集电器部分32通过经由间隔件33,34和35涂覆并填充其间的导热填料而附接到散热片42，并且另一个半导体开关元件36的暴露的集电极部分37是 通过在其上没有任何间隔物将导热填料41涂覆在同一个散热片42上，可以有效地将传导损耗的热量传递到散热片42并且可从其辐射。 即使两个半导体开关元件串联连接，即使将两个半导体开关元件串联连接，也能将由开关损耗产生的热量有效地传递到散热片并散热，因此集电器部件的后侧露出，两个半导体开关元件 连接到单个散热片。