公开(公告)号：WO1993007659A1

公开(公告)日：1993-04-15

申请号：PCT/US1992008624

申请日：1992-10-09

Applicant: IFAX CORPORATION

Inventor： IFAX CORPORATION ,  CHOW, Vincent

IPC: H01R13/00

CPC classification number: H01L23/4006 ,  H01L25/0652 ,  H01L2023/4043 ,  H01L2023/4062 ,  H01L2023/4068 ,  H01L2023/4081 ,  H01L2224/13109 ,  H01L2924/10253 ,  H01L2924/3011 ,  H01R12/714 ,  H01L2924/00

Abstract: A system for directly connecting one integrated circuit to another achieved by depositing gold onto the bonding pads of both integrated circuits, aligning the respective bonding pads and biasing both circuits into gas-tight, electrically conductive relation through the use of an initial compression force and a spring assembly. The gold bumps deposited on the bonding pads include ridges to ensure an optimal gas-tight seal. Alignment posts are also inserted through the host integrated circuit, which match notches cut into the periphery of the target integrated circuit, to ensure proper polarization and mating of the bonding pads of each integrated circuit. The integrated circuits and spring assembly are housed, and thus held together by, a carrier assembly. The carrier assembly also serves to dissipate heat generated by the integrated circuits, adapts for mounting on a printed circuit board, and includes a ferrule over an optical sensing area provided on the host integrated circuit.

Abstract translation: 一种用于将一个集成电路直接连接到另一个集成电路的系统，其通过在两个集成电路的接合焊盘上沉积金而实现，其通过使用初始压缩力和两个电路对准各自的焊盘并将两个电路偏置成气密的导电关系， 弹簧总成。 沉积在接合焊盘上的金凸块包括脊，以确保最佳的气密密封。 对准柱也通过主机集成电路插入，该主机集成电路匹配切割到目标集成电路的周边的切口，以确保每个集成电路的焊盘的适当偏振和匹配。 集成电路和弹簧组件被容纳在一起，并由此由载体组件保持在一起。 载体组件还用于散发由集成电路产生的热量，适于安装在印刷电路板上，并且包括在主机集成电路上提供的光学感测区域上的套圈。