-
公开(公告)号:WO2021191757A1
公开(公告)日:2021-09-30
申请号:PCT/IB2021/052318
申请日:2021-03-19
发明人: MA, Jiaying , DEVE, Herve E. , ELLINGHAM, Thomas K., Jr. , JENNEN, Jay M. , MEYER, Scott R. , SCHENIAN, Christopher M.
IPC分类号: H01L31/054 , B32B17/10 , B32B37/12 , B32B17/10678 , B32B17/10697 , B32B17/10788 , B32B17/10816 , B32B17/10972 , B32B2457/12 , B32B37/003 , H01L31/048 , H01L31/0547
摘要: A method of applying an adhesive to a substrate to mitigate entrapment of air bubbles during a vacuum lamination process is described. The method comprises contacting the adhesive to a surface of the substrate and applying a periodic force to the adhesive along the longitudinal direction creating first regions having a first adhesion strength to the substrate and second regions having a second adhesion strength to the substrate, wherein the second adhesion strength is less than 90% of the first adhesion strength.