REMOTE SYSTEM UPDATE AND MONITORING
    11.
    发明申请

    公开(公告)号:WO2022079548A1

    公开(公告)日:2022-04-21

    申请号:PCT/IB2021/059161

    申请日:2021-10-06

    Abstract: A processor receives input data comprising: (i) a code level for an update, (ii) a scheduled time for the update; (iii) a target system for the update, and (iv) authorization data, wherein the authorization data: (i) allows for scheduling of the update and (ii) is provided via a channel external from a connection to the target system without a inbound connection. A processor receives a set of data from the target system. A processor, responsive to receiving the set of data from the target system, sends a response packet to the target system that includes the input data. A processor receives, at the scheduled time, a request to process the update. A processor, responsive to the request, sends code for processing the update corresponding to the code level for the update. A processor receives status messages corresponding to progress of the update.

    FAIR ANOMALY DETECTION AND LOCALIZATION
    14.
    发明申请

    公开(公告)号:WO2022023861A1

    公开(公告)日:2022-02-03

    申请号:PCT/IB2021/056436

    申请日:2021-07-16

    Abstract: Techniques for fair anomaly detection include generating an anomaly detection model based on a Gaussian distribution of historical data, a mean vector of the Gaussian distribution, and a precision matrix of the Gaussian distribution. The mean vector and the precision matrix can be generated by reducing a function below a threshold, where the function can include the Gaussian distribution, a first regularization term configured to generate similar anomaly scores for inputs with similar fair features and independent of unfair features, and a second regularization term configured to generate similar anomaly localization scores for the inputs with the similar fair features and independent of the unfair features. The techniques further include inputting a new data to the anomaly detection model and generating an anomaly score and an anomaly localization score associated with the new data based on the Gaussian distribution, the mean vector, and the precision matrix.

    INTERPOSER-LESS MULTI-CHIP MODULE
    16.
    发明申请

    公开(公告)号:WO2022009086A1

    公开(公告)日:2022-01-13

    申请号:PCT/IB2021/056039

    申请日:2021-07-06

    Abstract: Interposer-less multi-chip module are provided. In one aspect, an interposer-less multi-chip module includes: a substrate; a base film disposed on the substrate; and chips pressed into the base film, wherein top surfaces of the chips are coplanar. For instance, the chips can have varying thicknesses and are pressed into the base film to different depths such that top surfaces of the chips are coplanar. An interconnect layer having back-end-of line (BEOL) metal wiring can be present on the wafer over the chips. Methods of forming an interposer-less multi-chip module are also provided.

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