ON-DIE HEATING CIRCUIT AND CONTROL LOOP FOR RAPID HEATING OF THE DIE
    41.
    发明申请
    ON-DIE HEATING CIRCUIT AND CONTROL LOOP FOR RAPID HEATING OF THE DIE 审中-公开
    加热加热电路和控制环用于快速加热DIE

    公开(公告)号:WO2007016601A3

    公开(公告)日:2007-04-26

    申请号:PCT/US2006030015

    申请日:2006-08-01

    CPC classification number: H01L23/345 H01L23/34 H01L2924/0002 H01L2924/00

    Abstract: An integrated circuit includes a heating circuit configured to heat the integrated circuit under the control of a controller. A transfer function with adjustable pole (P), zero (Z) and overall gain (Gain) is implemented in the controller such that a temperature response of the integrated circuit can be changed by adjusting one or more of the adjustable pole (P), zero (Z) and overall gain (Gain).

    Abstract translation: 集成电路包括被配置为在控制器的控制下加热集成电路的加热电路。 在控制器中实现具有可调极(P),零(Z)和总增益(Gain)的传递函数,使得可以通过调节可调节极(P)中的一个或多个来改变集成电路的温度响应, 零(Z)和总增益(增益)。

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