公开(公告)号：WO2021102097A1

公开(公告)日：2021-05-27

申请号：PCT/US2020/061206

申请日：2020-11-19

Applicant: LUMILEDS LLC

Inventor： HIN, Tze Yang ,  VAIDYANATHAN, Anantharaman ,  BANNA, Srini ,  BONNE, Ronald, Johannes

IPC: H01L33/64 ,  H01L27/15

Abstract: Systems are described. A system includes a silicon backplane having a top surface, a bottom surface, and side surfaces and a substrate surrounding the side surfaces of the silicon backplane. The substrate has a top surface, a bottom surface and side surfaces. At least one bond pad is provided on the bottom surface of the substrate. A metal layer is provided on the bottom surface of the substrate and the bottom surface of the silicon backplane and has a first portion electrically and thermally coupled to the bottom surface of the silicon backplane in a central region and second portions that extend between a perimeter region of the silicon backplane and the at least one bond pad. An array of metal connectors is provided on the top surface of the silicon backplane.

公开(公告)号：WO2020205581A1

公开(公告)日：2020-10-08

申请号：PCT/US2020/025378

申请日：2020-03-27

Applicant: LUMILEDS LLC

Inventor： HIN, Tze Yang ,  XUE, Qing

IPC: H01L25/075 ,  H01L27/15 ,  H01L33/62 ,  H05K1/14 ,  H05K1/03 ,  H05K1/02 ,  H05K3/34 ,  H05K3/46 ,  H01L33/64

Abstract: Methods of manufacture are described. A method includes forming a first cavity in a substrate and placing a backplane in the first cavity. At least one layer of dielectric material is formed over the substrate and the backplane. A second cavity is formed in the at least one layer of the dielectric material to expose at least a portion of a surface of the backplane. A heat conductive material is placed in the second cavity and in contact with the at least the portion of the surface of the backplane.

公开(公告)号：WO2018106373A1

公开(公告)日：2018-06-14

申请号：PCT/US2017/060215

申请日：2017-11-06

Applicant: LUMILEDS LLC

Inventor： VAN DER SIJDE, Arjen Gerben ,  VAN VOORST VADER, Quint ,  PFEFFER, Nicola

IPC: H01L27/15 ,  H01L33/50 ,  H01L33/00 ,  G03B15/03

Abstract: A segmented light or optical power emitting device and an illumination device are described. The segmented device includes a die having a light or optical power emitting semiconductor structure that includes an active layer disposed between an n-layer and a p-layer. Trenches are formed in at least the semiconductor structure and separate the die into individually addressable segments. The active layer emits light or optical power having a first color point or spectrum. At least one wavelength converting layer is adjacent the die and converts the light or optical power to light or optical power having at least one second color point or spectrum and limits an energy ratio of the pump light or optical power that passes through the at least one wavelength converting layer unconverted to total light or optical power emitted by the light or optical power emitting device to less than 10%.

公开(公告)号：WO2018067658A1

公开(公告)日：2018-04-12

申请号：PCT/US2017/055073

申请日：2017-10-04

Applicant: LUMILEDS LLC

Inventor： ESTRADA, Daniel ,  SHIMIZU, Ken ,  ROITMAN, Daniel ,  BOHMER, Marcel Rene ,  KANG, Edward

IPC: H01L33/56

Abstract: Light emitting devices (LEDs) are described herein. An LED includes a light emitting semiconductor structure, a wavelength converting material and an off state white material. The light emitting semiconductor structure includes a light-emitting active layer disposed between an n-layer and a p-layer. The wavelength converting material has a first surface adjacent the light emitting semiconductor structure and a second surface opposite the first surface. The off state white material is in direct contact with the second surface of the wavelength converting material and includes multiple core-shell particles disposed in an optically functional material. Each of the core-shell particles includes a core material encased in a polymer or inorganic shell. The core material includes a phase change material.

Abstract translation: 这里描述了发光器件（LED）。 LED包括发光半导体结构，波长转换材料和关闭状态白色材料。 发光半导体结构包括设置在n层和p层之间的发光有源层。 波长转换材料具有与发光半导体结构相邻的第一表面和与第一表面相对的第二表面。 断态白色材料与波长转换材料的第二表面直接接触并且包括设置在光学功能材料中的多个核 - 壳粒子。 每个核 - 壳颗粒包括包裹在聚合物或无机壳中的核心材​​料。 核心材料包括相变材料。

公开(公告)号：WO2023038986A1

公开(公告)日：2023-03-16

申请号：PCT/US2022/042778

申请日：2022-09-07

Applicant: LUMILEDS LLC

Inventor： KLEIJNEN, Christian ,  MONESTIER, Florent Grégoire ,  MÜLDERS, Barbara Roswitha ,  KURTH, Tobias ,  HENNINGER, Georg Friedrich Alfons

IPC: F21S4/24 ,  F21S41/151 ,  F21S43/15 ,  F21V23/00 ,  F21V23/06 ,  H05K1/18 ,  F21Y103/10 ,  F21Y107/70 ,  F21Y115/10

Abstract: An LED lighting strip, method of manufacturing an LED lighting strip and an automotive lighting system are described. The LED lighting strip (100) includes at least two outer wires (12, 14), at least one central wire (15) between the two outer wires, LEDs (22) arranged along the LED lighting strip and electrically coupled at least to the at least two outer wires (12, 14), and an enclosing member (52) enclosing the at least two outer wires, the at one central wire and the LEDs. The at least two outer wires (12, 14) and the least one central wire (15) have a bend (51) in sections between at least some adjacent LEDs (22).

公开(公告)号：WO2023028121A1

公开(公告)日：2023-03-02

申请号：PCT/US2022/041341

申请日：2022-08-24

Applicant: LUMILEDS LLC

Inventor： STRAETMANS, Jean-Sebastien

IPC: B60Q1/26 ,  B60Q1/38 ,  B60Q1/44 ,  B60Q1/50 ,  F21S43/14 ,  F21S43/19 ,  F21S43/20 ,  F21S43/31 ,  F21K9/232 ,  F21W103/35 ,  F21W103/20 ,  F21W103/60

Abstract: An LED retrofit signaling lamp is described herein. The lamp includes a lamp body, which includes a cap, a projection part, and a burner part between the cap and the projection part. Power contacts are exposed from the cap. A projection LED light source is provided in the projection part and angled to provide a projected image near to the vehicle when activated. A signaling LED light source is provided in the burner part angled to emit non-projected light via the projection part at angles that avoid the emitted light being blocked by the projection LED light source. The projection LED light source and the signaling LED light source are electrically coupled to the power contacts in parallel to each other.

公开(公告)号：WO2023283489A1

公开(公告)日：2023-01-12

申请号：PCT/US2022/036709

申请日：2022-07-11

Applicant: LUMILEDS LLC

Inventor： DECKERS, Michael

IPC: H01L25/075 ,  H01L33/62 ,  F21S41/153

Abstract: A composite array has two two-dimensional arrays on a substrate each having two rows of LEDs. The LEDs in each array have the same orientation as all other LEDs in that array. First electrical traces sequentially couple LEDs in the first string and the second string by beginning at opposite corners of the composite array and alternating between rows of each of the first and second arrays. A second electrical trace couples ends of the first and second strings across rows of the composite array. Third electrical traces route outside the composite array and are coupled, respectively, to a beginning of the first string for the row of the composite array containing the beginning of the first string, a beginning of the second string for the other row, the end of the first LED string for the other row, and electrodes of LEDs in the other row.

公开(公告)号：WO2022212548A1

公开(公告)日：2022-10-06

申请号：PCT/US2022/022604

申请日：2022-03-30

Applicant: IDAC HOLDINGS, INC.

Inventor： RAO, Jaya ,  FREDA, Martino ,  TEYEB, Oumer ,  HOANG, Tuong

IPC: H04W40/02 ,  H04W28/02

Abstract: Methods and apparatus for supporting adaptive quality of service (QoS) in sidelink relays are described. A wireless transmit/receive unit (WTRU) includes a transceiver and a processor. The transceiver and the processor receive a configuration, from a wireless network, the configuration indicating an initial first hop latency budget for communications via a relay WTRU. They also receive one or more packets from a higher layer and receive an indication from the relay WTRU. The transceiver and the processor also determine an updated first hop latency budget based at least on the received indication.

公开(公告)号：WO2022026911A1

公开(公告)日：2022-02-03

申请号：PCT/US2021/044038

申请日：2021-07-30

Applicant: LUMILEDS LLC

Inventor： LU, Kang

IPC: F21S41/20 ,  F21S41/153 ,  F21S41/63 ,  F21W102/00 ,  F21W107/10

Abstract: An automotive lighting system for a vehicle includes a light source, a refraction lens and a projection lens. The light source includes a first sub light source. The refraction lens includes a light entrance surface and a light exit surface. The light entrance surface has a first protrusion that has a first light entrance face adjacent the first sub light source and a first light exit face on the light entrance surface of the first refraction lens. The first protrusion is located at a periphery of the light entrance surface of the refraction lens with respect to an optical axis of the automotive lighting system.

公开(公告)号：WO2022011280A1

公开(公告)日：2022-01-13

申请号：PCT/US2021/041117

申请日：2021-07-09

Applicant: LUMILEDS LLC

Inventor： CHEN, Shengjin-Sj ,  YU, Gao Jie ,  SHEN, Qiao ,  TANG, Guang Hu

IPC: F21K9/237 ,  F21V29/90 ,  F21Y115/10 ,  F21Y2115/10

Abstract: An LED bulb includes a center ring, a burner and an elastic component. The center ring includes a central opening, a first flat rim extending along a first part of an outer edge of the central opening, and a first notch cut-out beyond the central opening at an end of the first flat rim. The burner is disposed at least in part in the central opening and includes a first pin that has a first flat side face. The elastic component is configured to press the first flat rim of the center ring against the first flat side face of the first pin of the burner.