Abstract:
A method for manufacturing structure on a printed circuit board substrate according to the invention includes positioning a printed circuit board substrate in a machine capable of performing piezoelectric deposition of a fluid manufacturing material. The printed circuit board substrate is aligned with a piezoelectric deposition head of the machine. Computer numeric control of the relative motion of the printed circuit board substrate and the piezoelectric deposition head allows droplets of the fluid manufacturing material to be deposited at selected locations of the printed circuit board substrate. The printed circuit board substrate includes a conductive surface layer and a masking structure that exposes selected portions of the surface layer, thereby forming traces upon removal of selected portions of the surface layer. Further, the structure manufactured on the printed circuit board may be a resistor.
Abstract:
A microdeposition system (20) and method deposits precise amounts of fluid material onto a substrate. A microdeposition head (50) includes a plurality of spaced nozzles. A positioning device controls a position of the microdeposition head relative to the substrate. A controller (22) includes a positioning module that communicates with the positioning device and that generates position control signals for the positioning device. A nozzle firing module communicates with the microdeposition head (50) and selectively generates nozzle firing commands to define features of at least one layer of an electrical device, such as resistors, traces and capacitors on a printed circuit board, polymer light emitting diodes, and light panels.
Abstract:
A microdeposition system (20) and method deposits precise amounts of fluid material onto a substrate. A microdeposition head (50) includes a plurality of spaced nozzles that fire droplets having a deposited width when deposited on the substrate. A positioning device moves the microdeposition head (50) relative to the substrate at a head speed. A controller (22) generates over-clocking signals at a rate that is substantially greater than the head speed divided by the droplet width to improve resolution. The controller (22) includes a positioning module that generates position control signals for the positioning device. The controller (22) includes a nozzle firing module (114) that generates nozzle firing commands based on the over-clocking rate to fire the nozzles to form droplets that define features on the substrate.
Abstract:
A method and system for compensating for swath skew with respect to a perpendicular direction of carrier travel. An amount of swath skew is determined, and gross and/or fine skew adjustments are applied to reduce the swath skew to visually imperceptible limits. The method and system according to this invention can be carried out through software and/or hardware and thus eliminates the need for mechanical adjustment of an ink jet printer. The method and system operates by determining appropriate gross and fine skew adjustments upon insertion of a new printhead into a carrier. The fire order sequence of the fire groups in the printhead can be altered, and the swath data adjusted to compensate for swath skew caused by nozzle plate and/or printer skew with respect to the perpendicular direction of carrier travel.