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    SOLDERLESS WIRE-TO-BOARD SINGLE PAIR ETHERNET CONNECTION SYSTEM
    1.
    发明申请
    SOLDERLESS WIRE-TO-BOARD SINGLE PAIR ETHERNET CONNECTION SYSTEM 审中-公开

    公开(公告)号：WO2022066912A1

    公开(公告)日：2022-03-31

    申请号：PCT/US2021/051759

    申请日：2021-09-23

    Applicant: AVX CORPORATION

    Inventor： MINCEY, Jackie

    IPC: H01R24/64 ,  H01R13/627

    Abstract: This disclosure provides a method and apparatus for a single pair Ethernet (SPE) wire-to-board connector. The SPE connector may include a female connector portion and a male connector portion. The female connector portion may include a first electrical contact having a first press-fit pin and a first female portion, a second electrical contact having a second press-fit pin and a second female portion, and a first outer shield, the first outer shield mechanically secured to the first insulative housing. The first and second electrical contacts may be positioned partially within the first insulative housing. The male connector portion includes a third electrical contact comprising a first insulation displacement contact (IDC) portion and a first male portion, a fourth electrical contact comprising a second IDC portion and a second male portion, and a second outer shield, the second outer shield mechanically secured to a second insulative housing.

    TEMPERATURE SENSOR ASSEMBLY FACILITATING BEAM STEERING IN A TEMPERATURE MONITORING NETWORK
    2.
    发明申请
    TEMPERATURE SENSOR ASSEMBLY FACILITATING BEAM STEERING IN A TEMPERATURE MONITORING NETWORK 审中-公开

    公开(公告)号：WO2022047015A1

    公开(公告)日：2022-03-03

    申请号：PCT/US2021/047728

    申请日：2021-08-26

    Applicant: AVX CORPORATION

    Inventor： DESCLOS, Laurent ,  NIES, Craig W. ,  PAJONA, Olivier

    IPC: A61B5/00 ,  A61B5/01 ,  G16H50/80

    Abstract: A temperature sensor assembly can include a first temperature sensor that can be configured to obtain a first temperature measurement of a user. The temperature sensor assembly can further include a second temperature sensor that can be configured to obtain a second temperature measurement of the user. The temperature sensor assembly can further include one or more processors that can be configured to determine a third temperature measurement indicative of a temperature of the user based at least in part on the first temperature measurement and the second temperature measurement. The temperature sensor assembly can further include a base station communication antenna system that can include a modal antenna that can be configured to communicate the third temperature measurement with a base station based at least in part on a beam steering operation.

    TANTALUM CAPACITOR WITH INCREASED STABILITY
    4.
    发明申请
    TANTALUM CAPACITOR WITH INCREASED STABILITY 审中-公开

    公开(公告)号：WO2021119088A1

    公开(公告)日：2021-06-17

    申请号：PCT/US2020/063946

    申请日：2020-12-09

    Applicant: AVX CORPORATION

    Inventor： KUCHARCZYK, Pavel ,  UHER, Miloslav ,  PETRZILEK, Jan

    IPC: H01G9/025 ,  H01G9/042

    Abstract: A solid electrolytic capacitor containing a capacitor element is provided. The capacitor element contains an anode body that contains tantalum, a dielectric that overlies the anode body; and a solid electrolyte that overlies the dielectric. The solid electrolyte includes an intrinsically conductive polymer containing repeating thiophene units. Further, the capacitor exhibits a dielectric strength of about 0.6 volts per nanometer or more. The capacitor also exhibits a charge-discharge capacitance after being subjected to 3,000 cycles of a surge voltage and an initial capacitance prior to being subjected to the surge voltage, wherein the ratio of the charge-discharge capacitance to the initial capacitance is from about 0.75 to 1.

    HIGH VOLTAGE CONTACT SYSTEM
    5.
    发明申请
    HIGH VOLTAGE CONTACT SYSTEM 审中-公开

    公开(公告)号：WO2020188427A1

    公开(公告)日：2020-09-24

    申请号：PCT/IB2020/052255

    申请日：2020-03-12

    Applicant: AVX CORPORATION

    Inventor： NEEF, Wolfgang ,  STOCKSCHLAEDER, Marvin ,  TECHT, Matthias

    IPC: H01R13/53 ,  H01R12/70 ,  H01R13/707

    Abstract: This disclosure provides a method and apparatus for connecting wires and interlocking wires to an electrical component. More specifically, an electrical connector that includes an insulative housing, two electrical contacts, and two interlocking contacts is disclosed. In an embodiment, each electrical contact includes a female end, a press-fit end, and a transition portion. The transition portion is designed such that the first female end and the first press-fit end may be properly aligned depending on the application. The transition portion also provides support and stability to the electrical contacts when they are disposed within the insulative housing. The insulative housing includes four contact recesses. In an embodiment, the electrical connector allows for the safe, efficient, re-usable, and reliable connection for connecting high-voltage wires to a corresponding sensitive electrical component (e.g., a printed circuit board).

    SYSTEM AND METHOD FOR CONTROLLING A VOLTAGE TUNABLE MULTILAYER CAPACITOR
    6.
    发明申请
    SYSTEM AND METHOD FOR CONTROLLING A VOLTAGE TUNABLE MULTILAYER CAPACITOR 审中-公开

    公开(公告)号：WO2020139681A1

    公开(公告)日：2020-07-02

    申请号：PCT/US2019/067385

    申请日：2019-12-19

    Applicant: AVX CORPORATION

    Inventor： CAIN, Jeffrey ,  HOCK, Joseph M.

    IPC: H01G7/06 ,  H01G4/30

    Abstract: A controller and system for tuning a voltage tunable capacitor is provided. The controller may include at least one analog-to-digital converter configured to receive at least one input signal and convert the at least one input signal into at least one digital signal. The controller may include a processor configured to process the at least one digital signal using logic to generate an output signal. The controller may include a charge pump configured to boost the output signal to generate a boosted output signal. The controller may be configured to provide the boosted output signal to the voltage tunable capacitor to adjust a bias voltage of the voltage tunable capacitor.

    MULTILAYER FILTER INCLUDING A LOW INDUCTANCE VIA ASSEMBLY
    7.
    发明申请
    MULTILAYER FILTER INCLUDING A LOW INDUCTANCE VIA ASSEMBLY 审中-公开

    公开(公告)号：WO2020132022A1

    公开(公告)日：2020-06-25

    申请号：PCT/US2019/067099

    申请日：2019-12-18

    Applicant: AVX CORPORATION ,  CHOI, Kwang

    Inventor： CHOI, Kwang ,  BEROLINI, Marianne

    IPC: H01P1/203 ,  H01P3/08 ,  H01P11/00 ,  H03H7/01 ,  H03H1/00

    Abstract: A multilayer filter may include a dielectric layer having a top surface, a bottom surface, and a thickness in a Z-direction between the top surface and the bottom surface. The multilayer filter may include a conductive layer formed on the top surface of the dielectric layer. The multilayer filter may include a via assembly formed in the dielectric layer and connected to the conductive layer on the top surface of the dielectric layer. The via assembly may extend to the bottom surface of the dielectric layer. The via assembly may have a length in the Z-direction and a total cross-sectional area in an X-Y plane that is perpendicular to the Z-direction. The via assembly may have an area-to-squared-length ratio that is greater than about 3.25.

    HIGH POWER SURFACE MOUNT FILTER
    9.
    发明申请
    HIGH POWER SURFACE MOUNT FILTER 审中-公开

    公开(公告)号：WO2020060976A1

    公开(公告)日：2020-03-26

    申请号：PCT/US2019/051413

    申请日：2019-09-17

    Applicant: AVX CORPORATION

    Inventor： CHOI, Kwang ,  BEROLINI, Marianne ,  KIRK, Michael W. ,  FUENTES, Hector ,  HERR, Jonathan ,  SEITHER, Bryan

    IPC: H01P11/00 ,  H01P1/30 ,  H01P1/203

    Abstract: A filter assembly is disclosed that includes a monolithic filter having a surface and a heat sink coupled to the surface of the monolithic filter. The heat sink includes a layer of thermally conductive material that can have a thickness greater than about 0.02 mm. The heat sink may provide electrical shielding for the monolithic filter. In some embodiments, the filter assembly may include an organic dielectric material, such as liquid crystalline polymer or polyphenyl ether. In some embodiments, the filter assembly may include an additional monolithic filter.

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