REFRIGERATION CYCLE UTILIZING A MIXED INERT COMPONENT REFRIGERANT
    2.
    发明申请
    REFRIGERATION CYCLE UTILIZING A MIXED INERT COMPONENT REFRIGERANT 审中-公开
    制冷循环利用混合的惰性元件制冷剂

    公开(公告)号:WO2005072404A3

    公开(公告)日:2007-07-26

    申请号:PCT/US2005002729

    申请日:2005-01-28

    Abstract: The disclosure is directed to a cooling system that includes a first refrigerant cycle and a second refrigerant cycle. The first refrigerant cycle has a first refrigerant and the second refrigerant cycle has a second refrigerant comprising a mixture of cryogenic components. The disclosure is also directed to a cooling system that includes a first refrigerant cycle and a second refrigerant cycle. The first refrigerant cycle has a first refrigerant. The second refrigerant cycle has a second refrigerant comprising a non-reactive component. The second refrigerant is free of fluorocarbons, chlorofluorocarbons, and hydrocarbons. At least a portion of the second refrigerant is condensed in the second refrigerant cycle.

    Abstract translation: 本公开涉及包括第一制冷剂循环和第二制冷剂循环的冷却系统。 第一制冷剂循环具有第一制冷剂,第二制冷剂循环具有包含低温组分的混合物的第二制冷剂。 本公开还涉及包括第一制冷剂循环和第二制冷剂循环的冷却系统。 第一制冷剂循环具有第一制冷剂。 第二制冷剂循环具有包含非反应性组分的第二制冷剂。 第二制冷剂不含碳氟化合物,氯氟烃和碳氢化合物。 第二制冷剂的至少一部分在第二制冷剂循环中冷凝。

    ULTRA-LOW TEMPERATURE CLOSED-LOOP RECIRCULATING GAS CHILLING SYSTEM
    5.
    发明申请
    ULTRA-LOW TEMPERATURE CLOSED-LOOP RECIRCULATING GAS CHILLING SYSTEM 审中-公开
    超低温闭环循环气体冷却系统

    公开(公告)号:WO2002095308A2

    公开(公告)日:2002-11-28

    申请号:PCT/US2002/005801

    申请日:2002-02-25

    IPC: F25J

    CPC classification number: F25B7/00 F25B9/006 F25D2400/28

    Abstract: Disclosed is an ultra-low temperature, dual-compressor, recirculating gas chilling system that includes a closed-loop mixed-refrigerant primary refrigeration system in combination with a closed-loop gas secondary refrigeration loop. The ultra-low temperature, dual-compressor, recirculating gas chilling system disclosed is capable of providing continuous long term chilled gas and fast cooling of a high or ambient temperature object, such as a chuck used in processing semiconductor wafers or any such device. The gas chilling system is characterized by three modes of operation: a normal cooling mode, a bakeout mode, and a post-bake cooling mode.

    Abstract translation: 公开了一种超低温双压缩机(114,144)循环气体冷却系统,其包括与闭环气体二次制冷回路(112)组合的闭环混合制冷剂初级制冷系统(110)。 所公开的超低温双压缩机(114,144)再循环气体冷却系统能够提供连续的长期冷却气体并且快速冷却高温或环境温度物体(158),例如用于处理半导体晶片的卡盘 或任何此类设备。 燃气冷冻系统的特征在于三种操作模式:正常冷却模式,烘烤模式和后烘箱冷却模式。

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