公开(公告)号：WO2004076394A1

公开(公告)日：2004-09-10

申请号：PCT/US2004/001118

申请日：2004-01-16

Applicant: DOW GLOBAL TECHNOLOGIES, INC. ,  DOW DEUTSCHLAND GMBH & CO. OHG ,  PATRASCU, Emil ,  FREY, Johann-Wilhelm ,  HAGEL, Manfred

Inventor： PATRASCU, Emil ,  FREY, Johann-Wilhelm ,  HAGEL, Manfred

IPC: C07C37/82

CPC classification number: C07C37/70 ,  C07C37/68 ,  C07C37/685 ,  C07C37/74 ,  C07C37/82 ,  C07C37/84 ,  C07C39/16

Abstract: A process for recovering a solid adduct of a bis(4-hydroxyaryl)alkane and a phenolic compound from a suspension comprising the addict is disclosed. The process comprises the steps of a) supplying the suspension to a rotary filter, b) filtering the supplied suspension in the rotary filter to retain adduct as an adduct cake, c) pre-drying the adduct cake with an inert gas, d) washing the pre-dried adduct cake, e) optionally drying the washed adduct cake, and f) discharging the washed adduct cake from the rotary filter.

Abstract translation: 公开了一种从包含该吸附剂的悬浮液中回收二（4-羟基芳基）烷烃和酚类化合物的固体加合物的方法。 该方法包括以下步骤：a）将悬浮液供应到旋转过滤器，b）过滤旋转过滤器中供应的悬浮液以保留加合物作为加合物饼，c）用惰性气体预干燥加合物饼，d）洗涤 预干燥的加合物滤饼，e）任选干燥洗涤过的加合物滤饼，和f）从旋转过滤器中排出洗涤过的加合物滤饼。

公开(公告)号：WO2005047393A1

公开(公告)日：2005-05-26

申请号：PCT/EP2004/012476

申请日：2004-11-04

Applicant: DOW BENELUX BV ,  DOW AUTOMOTIVE AG ,  DOW DEUTSCHLAND GMBH & CO. OHG. ,  KRABBENBORG, Franciscus, J., T. ,  BELOT, Philippe ,  HOUG, Jacobus, Jan ,  ROUSSE, Martine

Inventor： KRABBENBORG, Franciscus, J., T. ,  BELOT, Philippe ,  HOUG, Jacobus, Jan ,  ROUSSE, Martine

IPC: C08L63/00

CPC classification number: C08F299/024 ,  C08L63/00 ,  C08L67/00 ,  C08L2205/02 ,  C08L2205/03 ,  C08L2205/035 ,  C08L2666/02 ,  C08L2666/22 ,  C09J123/0869 ,  C09J163/00

Abstract: A reactive hot melt composition having a softening point of at least 50°C comprising an epoxy resin having a softening point of at least 50°C, at least one random interpolymer of ethylene and at least one olefinically unsaturated carboxylic acid comonomer, olefinically unsaturated carboxylicl acid ester comonomer, or vinyl ester comonomer. The epoxy resin is such that the composition may be caused to adhere to a surface by heating the composition to an application temperature in excess of the softening point of the composition, to form a melted adhesive composition. The composition is thereafter curable by heating to a curing temperature to cure the epoxy resin, the curing temperature being in excess of the application temperature. Methods for making the composition are also disclosed, as well as a method for adhering a first component to a second component using the compositions.

Abstract translation: 软化点为至少50℃的反应性热熔组合物包含软化点至少为50℃的环氧树脂，至少一种乙烯和至少一种烯属不饱和羧酸共聚单体的无规互聚物，烯属不饱和羧酸酯 酸酯共聚单体或乙烯基酯共聚单体。 环氧树脂使得可以通过将组合物加热到超过组合物的软化点的施加温度使组合物粘附到表面上，以形成熔融的粘合剂组合物。 然后通过加热至固化温度固化组合物以固化环氧树脂，固化温度超过施加温度。 还公开了制备组合物的方法，以及使用该组合物将第一组分粘附到第二组分的方法。