公开(公告)号：WO2016048352A1

公开(公告)日：2016-03-31

申请号：PCT/US2014/057686

申请日：2014-09-26

Applicant: INTEL CORPORATION ,  ATHREYA, Dhanya ,  CHAWLA, Gaurav ,  AYGUN, Kemal ,  HEPPNER, Joshua D. ,  NEKKANTY, Srikant ,  SMALLEY, Jeffory L. ,  CANNY, Sarah M. ,  GORDON, Glen P. ,  GARCIA, Michael

Inventor： ATHREYA, Dhanya ,  CHAWLA, Gaurav ,  AYGUN, Kemal ,  HEPPNER, Joshua D. ,  NEKKANTY, Srikant ,  SMALLEY, Jeffory L. ,  CANNY, Sarah M. ,  GORDON, Glen P. ,  GARCIA, Michael

IPC: H01R33/76 ,  H01L23/32

CPC classification number: H01R33/7685 ,  H01L23/32 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Embodiments of the present disclosure are directed towards socket contact techniques and configurations. In one embodiment, an apparatus may include a socket substrate having a first side and a second side disposed opposite to the first side, an opening formed through the socket substrate, an electrical contact disposed in the opening and configured to route electrical signals between the first side and the second side of the socket substrate, the electrical contact having a cantilever portion that extends beyond the first side, wherein the first side and surfaces of the socket substrate in the opening are plated with a metal. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例针对套接触接触技术和配置。 在一个实施例中，装置可以包括具有第一侧和与第一侧相对设置的第二侧的插座衬底，通过插座衬底形成的开口，设置在开口中并被配置为在第一 所述电接触件具有延伸超过所述第一侧面的悬臂部分，其中所述开口中的所述插座基板的所述第一侧面和所述表面镀有金属。 可以描述和/或要求保护其他实施例。