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    SYSTEM AND METHOD FOR FLOOR COVERING INSTALLATION
    2.
    发明申请
    SYSTEM AND METHOD FOR FLOOR COVERING INSTALLATION 审中-公开
    用于地板覆盖物安装的系统和方法

    公开(公告)号：WO2008119003A3

    公开(公告)日：2008-10-02

    申请号：PCT/US2008/058361

    申请日：2008-03-27

    Applicant: INTERFACE, INC. ,  ZAH, Chung-hsien ,  GRAY, Keith, N. ,  HENSLER, Connie, D. ,  FEZER, Susan, F. ,  BRADLEY, Horace, Eddie, Jr.

    Inventor： ZAH, Chung-hsien ,  GRAY, Keith, N. ,  HENSLER, Connie, D. ,  FEZER, Susan, F. ,  BRADLEY, Horace, Eddie, Jr.

    IPC: C09J7/02 ,  A47G27/04 ,  B65H37/00 ,  E04F15/02

    Abstract: Connectors for joining adjacent modular floor covering units. Embodiments of the connectors include a film and an adhesive layer coated on one side of the film. The connectors can have a conductive component that allows electrical continuity to be maintained between adjacent tiles. In yet another embodiment, the connectors can be equipped as radio frequency identification tags by including radio frequency transponders. To install tiles using the connectors, a first tile is placed on the floor and a connector is positioned so that the adhesive layer faces upward and does not contact the floor. The connector is typically positioned so that only a portion of the adhesive layer adheres to the underside of the tile, leaving the remainder of the connector extending from the underside of the tile. One or more tiles are then positioned adjacent the first tile so that a portion of the connector adheres to the adjacent tiles. In this way, the connectors span adjacent tile edges. The tiles are assembled on an underlying flooring surface without the need to attach them to the floor surface. Rather, the tiles are linked to each other with the connectors, so that the tiles create a floor covering that "floats" on the underlying floor surface. Additionally, the tiles need not be installed directly on the floor surface. Rather, an underlayment, such as a film or cushion or cushion composite, may be positioned on the floor surface prior to the installation of tiles.

    Abstract translation:

    用于连接相邻模块化地面覆盖单元的连接器。 连接器的实施例包括膜和涂覆在膜的一侧上的粘合剂层。 连接器可以具有允许在相邻瓷砖之间保持电连续性的导电部件。 在又一个实施例中，连接器可以通过包括射频转发器而被配备为射频识别标签。 为了使用连接器安装瓷砖，将第一块瓷砖放置在地板上并且定位连接器，使得粘合剂层面朝上并且不接触地板。 连接器通常被定位成使得仅粘合剂层的一部分粘附到瓦片的下侧，使得连接器的其余部分从瓦片的下侧延伸。 然后将一个或多个瓦片放置在第一瓦片附近，使得连接器的一部分粘附到相邻的瓦片。 以这种方式，连接器跨越相邻的瓷砖边缘。 瓷砖在底层地板表面上组装而不需要将它们连接到地板表面。 相反，瓷砖通过连接器相互连接，以便瓷砖形成“浮动”的地板覆盖物。 在下面的地板表面上。 此外，瓷砖不需要直接安装在地面上。 相反，在安装瓷砖之前，可以在地板表面上放置衬垫，例如薄膜或衬垫或衬垫复合物。

    SYSTEMS AND METHODS FOR MODULAR FLOOR INSTALLATION
    4.
    发明申请
    SYSTEMS AND METHODS FOR MODULAR FLOOR INSTALLATION 审中-公开

    公开(公告)号：WO2010118084A3

    公开(公告)日：2010-10-14

    申请号：PCT/US2010/030170

    申请日：2010-04-07

    Applicant: INTERFACE, INC. ,  GALLAGHER, Kevin, C. ,  GRAY, Keith, N. ,  FOLETTA, Robert, Henry

    Inventor： GALLAGHER, Kevin, C. ,  GRAY, Keith, N. ,  FOLETTA, Robert, Henry

    IPC: E04F15/18

    Abstract: Connectors for joining adjacent modular floor covering units. The connectors include a base or film and one or more attachment members. As an exemplary use of a connector to install tiles, a first tile is placed on the floor and a connector is positioned so that an attachment member faces upward and attach's to the first tile. One or more other tiles are then positioned adjacent the first tile so that the same or other attachment members of the connector attach to the adjacent tiles. In certain embodiments, an attachment member comprises projections that form a mechanical connection with the undersides of the tiles. For example, a connector may comprise a plastic unit with raised ridges that interact with corresponding indentations on the undersides of the tiles. A connector can also or alternatively form a connection with tiles and/or the underlying floor surface by having a high coefficient of friction.

    SYSTEM AND METHOD FOR FLOOR COVERING INSTALLATION
    5.
    发明申请
    SYSTEM AND METHOD FOR FLOOR COVERING INSTALLATION 审中-公开
    用于地面覆盖安装的系统和方法

    公开(公告)号：WO2008119003A2

    公开(公告)日：2008-10-02

    申请号：PCT/US2008058361

    申请日：2008-03-27

    Applicant: INTERFACE INC ,  ZAH CHUNG-HSIEN ,  GRAY KEITH N ,  HENSLER CONNIE D ,  FEZER SUSAN F ,  BRADLEY HORACE EDDIE JR

    Inventor： ZAH CHUNG-HSIEN ,  GRAY KEITH N ,  HENSLER CONNIE D ,  FEZER SUSAN F ,  BRADLEY HORACE EDDIE JR

    IPC: C09J7/02 ,  A47G27/04 ,  B65H37/00 ,  E04F15/02

    CPC classification number: E04F15/02 ,  A47G27/0475 ,  A47G27/0481 ,  B65H37/005 ,  B65H2401/211 ,  B65H2701/1922 ,  C09J7/0207 ,  C09J7/0246 ,  C09J7/0296 ,  C09J7/22 ,  C09J7/29 ,  C09J7/38 ,  C09J2203/314 ,  E04F2201/07 ,  G01S1/68 ,  G01S5/0027 ,  G06K2017/0045 ,  Y10T156/109 ,  Y10T428/16 ,  Y10T428/23993 ,  Y10T428/2848

    Abstract: Connectors for joining adjacent modular floor covering units. Embodiments of the connectors include a film and an adhesive layer coated on one side of the film. The connectors can have a conductive component that allows electrical continuity to be maintained between adjacent tiles. In yet another embodiment, the connectors can be equipped as radio frequency identification tags by including radio frequency transponders. To install tiles using the connectors, a first tile is placed on the floor and a connector is positioned so that the adhesive layer faces upward and does not contact the floor. The connector is typically positioned so that only a portion of the adhesive layer adheres to the underside of the tile, leaving the remainder of the connector extending from the underside of the tile. One or more tiles are then positioned adjacent the first tile so that a portion of the connector adheres to the adjacent tiles. In this way, the connectors span adjacent tile edges. The tiles are assembled on an underlying flooring surface without the need to attach them to the floor surface. Rather, the tiles are linked to each other with the connectors, so that the tiles create a floor covering that "floats" on the underlying floor surface. Additionally, the tiles need not be installed directly on the floor surface. Rather, an underlayment, such as a film or cushion or cushion composite, may be positioned on the floor surface prior to the installation of tiles.

    Abstract translation: 用于连接相邻模块化地板覆盖单元的连接器。 连接器的实施例包括膜和涂覆在膜的一侧上的粘合剂层。 连接器可以具有允许在相邻瓦片之间保持电连续性的导电部件。 在另一个实施例中，连接器可以通过包括射频转发器来配备为射频识别标签。 为了使用连接器安装瓦片，将第一瓦片放置在地板上，并且连接器被定位成使得粘合剂层面向上并且不接触地板。 连接器通常被定位成使得只有一部分粘合剂层粘附到瓦片的下侧，使得连接器的其余部分从瓦片的下侧延伸。 然后将一个或多个瓦片定位成与第一瓦片相邻，使得连接器的一部分粘附到相邻的瓦片。 以这种方式，连接器跨越相邻的瓦片边缘。 瓦片组装在下面的地板表面上，而不需要将它们附着在地板表面上。 相反，瓦片通过连接器彼此连接，使得瓦片产生“漂浮”在下面的地板表面上的地板覆盖物。 此外，瓦片不需要直接安装在地板表面上。 相反，在安装瓦片之前，可以将诸如胶片或缓冲垫或衬垫复合材料的底垫放置在地板表面上。

    SYSTEMS AND METHODS FOR MODULAR FLOOR INSTALLATION
    7.
    发明申请
    SYSTEMS AND METHODS FOR MODULAR FLOOR INSTALLATION 审中-公开
    用于模块化地面安装的系统和方法

    公开(公告)号：WO2010118084A2

    公开(公告)日：2010-10-14

    申请号：PCT/US2010030170

    申请日：2010-04-07

    Applicant: INTERFACE INC ,  GALLAGHER KEVIN C ,  GRAY KEITH N ,  FOLETTA ROBERT HENRY

    Inventor： GALLAGHER KEVIN C ,  GRAY KEITH N ,  FOLETTA ROBERT HENRY

    IPC: E04F15/18

    CPC classification number: E04F15/18 ,  E04F15/182

    Abstract: Connectors for joining adjacent modular floor covering units. The connectors include a base or film and one or more attachment members. As an exemplary use of a connector to install tiles, a first tile is placed on the floor and a connector is positioned so that an attachment member faces upward and attach's to the first tile. One or more other tiles are then positioned adjacent the first tile so that the same or other attachment members of the connector attach to the adjacent tiles. In certain embodiments, an attachment member comprises projections that form a mechanical connection with the undersides of the tiles. For example, a connector may comprise a plastic unit with raised ridges that interact with corresponding indentations on the undersides of the tiles. A connector can also or alternatively form a connection with tiles and/or the underlying floor surface by having a high coefficient of friction.

    Abstract translation: 用于连接相邻模块化地板覆盖单元的连接器。 连接器包括底座或薄膜以及一个或多个连接构件。 作为连接器用于安装瓦片的示例性使用，第一瓦片被放置在地板上，并且连接器被定位成使得附接构件面向上并且附接到第一瓦片。 然后将一个或多个其它瓦片定位成与第一瓦片相邻，使得连接器的相同或其它附接构件附接到相邻的瓦片。 在某些实施例中，附接构件包括与瓦片的下侧形成机械连接的突起。 例如，连接器可以包括具有凸起的脊的塑料单元，其与瓦片的下侧上的相应凹口相互作用。 连接器还可以或者可选地通过具有高摩擦系数形成与瓷砖和/或下层地板表面的连接。

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