公开(公告)号：WO2009141231A2

公开(公告)日：2009-11-26

申请号：PCT/EP2009/055510

申请日：2009-05-07

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION ,  IBM UNITED KINGDOM LIMITED ,  BANDY, William, IV ,  IBEN, Icko ,  MCKINLEY, Wayne

Inventor： BANDY, William, IV ,  IBEN, Icko ,  MCKINLEY, Wayne

IPC: G11B5/40 ,  G11B5/11

CPC classification number: G11B5/11 ,  G11B5/29 ,  G11B5/3106 ,  G11B5/40

Abstract: A system in one embodiment includes a substrate; a thin film structure coupled to the substrate, the thin film structure comprising at least one of read transducers and write transducers; a closure; and an electrostatically dissipative adhesive coupling the closure to at least one of the thin film structure and the substrate. The adhesive comprises a mixture comprising: an adhesive material; and electrically conductive particles intermixed with the adhesive material, the electrically conductive particles being present in an amount between 0 and about 10% by weight of a total weight of the mixture. The closure defines at least a portion of a tape bearing surface. Additional systems and methods are also presented.

Abstract translation: 一个实施例中的系统包括基板; 耦合到所述衬底的薄膜结构，所述薄膜结构包括读换能器和写换能器中的至少一个; 封闭 以及将所述封闭件耦合到所述薄膜结构和所述基板中的至少一个的静电消散粘合剂。 粘合剂包括混合物，其包括：粘合剂材料; 和与粘合剂材料混合的导电颗粒，导电颗粒以混合物总重量的0至约10重量％的量存在。 封闭件限定了带状表面的至少一部分。 还介绍了其他系统和方法。

公开(公告)号：WO2009141231A3

公开(公告)日：2010-01-14

申请号：PCT/EP2009055510

申请日：2009-05-07

Applicant: IBM ,  IBM UK ,  BANDY WILLIAM IV ,  IBEN ICKO ,  MCKINLEY WAYNE

Inventor： BANDY WILLIAM IV ,  IBEN ICKO ,  MCKINLEY WAYNE

IPC: G11B5/40 ,  G11B5/11

CPC classification number: G11B5/11 ,  G11B5/29 ,  G11B5/3106 ,  G11B5/40

Abstract: A system in one embodiment includes a substrate; a thin film structure coupled to the substrate, the thin film structure comprising at least one of read transducers and write transducers; a closure; and an electrostatically dissipative adhesive coupling the closure to at least one of the thin film structure and the substrate. The adhesive comprises a mixture comprising: an adhesive material; and electrically conductive particles intermixed with the adhesive material, the electrically conductive particles being present in an amount between 0 and about 10% by weight of a total weight of the mixture. The closure defines at least a portion of a tape bearing surface. Additional systems and methods are also presented.

Abstract translation: 一个实施例中的系统包括基板; 耦合到所述衬底的薄膜结构，所述薄膜结构包括读换能器和写换能器中的至少一个; 封闭 以及将所述封闭件耦合到所述薄膜结构和所述基板中的至少一个的静电消散粘合剂。 粘合剂包括混合物，其包括：粘合剂材料; 和与粘合剂材料混合的导电颗粒，导电颗粒以混合物总重量的0至约10重量％的量存在。 封闭件限定了带状表面的至少一部分。 还介绍了其他系统和方法。