公开(公告)号：WO2013154536A1

公开(公告)日：2013-10-17

申请号：PCT/US2012/032879

申请日：2012-04-10

Applicant: APPLIED MATERIALS, INC. ,  KURITA, Shinichi ,  INAGAWA, Makoto ,  KHO, Jeffrey A. ,  TINER, Robin L. ,  ANWAR, Suhail

Inventor： KURITA, Shinichi ,  INAGAWA, Makoto ,  KHO, Jeffrey A. ,  TINER, Robin L. ,  ANWAR, Suhail

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/02

CPC classification number: H01L21/67196

Abstract: A serial cluster tool system is provided. The system includes a first cluster tool having a first plurality of processing chambers and at least one first peripheral chamber, a second cluster tool having a second plurality of processing chambers and at least one second peripheral chamber, and an interchamber adapter device coupling the at least one first peripheral chamber to the at least one second peripheral chamber, the interchamber adapter device comprising a vacuum-proof flexible section coupled between sealing faces of the first chamber and the second chamber.

Abstract translation: 提供串行集群工具系统。 该系统包括具有第一多个处理室和至少一个第一周边室的第一集群工具，具有第二多个处理室和至少一个第二周边室的第二集群工具以及至少联接至少 一个至少一个第二周边室的第一周边室，所述车间适配器装置包括联接在所述第一室和第二室的密封面之间的防真空柔性部分。

公开(公告)号：WO2010091205A3

公开(公告)日：2010-11-25

申请号：PCT/US2010023236

申请日：2010-02-04

Applicant: APPLIED MATERIALS INC ,  CHOI SOO YOUNG ,  TINER ROBIN L ,  KURITA SHINICHI ,  WHITE JOHN M ,  SORENSEN CARL A ,  KHO JEFFREY A ,  ANWAR SUHAIL ,  FURUTA GAKU ,  INAGAWA MAKOTO

Inventor： CHOI SOO YOUNG ,  TINER ROBIN L ,  KURITA SHINICHI ,  WHITE JOHN M ,  SORENSEN CARL A ,  KHO JEFFREY A ,  ANWAR SUHAIL ,  FURUTA GAKU ,  INAGAWA MAKOTO

IPC: H05H1/34 ,  H01L21/205

CPC classification number: C23C16/5096 ,  C23C16/4585 ,  H01J37/32091 ,  H01J37/32174 ,  H01J37/32568 ,  H01L21/67069

Abstract: A method and apparatus for providing an electrically symmetrical ground or return path for electrical current between two electrodes is described. The apparatus includes at least on radio frequency (RF) device coupled to one of the electrodes and between a sidewall and/or a bottom of a processing chamber. The method includes moving one electrode relative to another and realizing a ground return path based on the position of the displaced electrode using one or both of a RF device coupled to a sidewall and the electrode, a RF device coupled to a bottom of the chamber and the electrode, or a combination thereof.

Abstract translation: 描述了一种用于提供用于两个电极之间的电流的电对称接地或返回路径的方法和装置。 该装置至少包括耦合到电极之一和处理室的侧壁和/或底部之间的射频（RF）装置。 该方法包括相对于另一个电极移动一个电极，并且基于使用耦合到侧壁和电极的RF装置之一或两者的位移电极实现接地返回路径，耦合到腔室的底部的RF装置和 电极或其组合。

公开(公告)号：WO2010091205A2

公开(公告)日：2010-08-12

申请号：PCT/US2010/023236

申请日：2010-02-04

Applicant: APPLIED MATERIALS, INC. ,  CHOI, Soo Young ,  TINER, Robin L. ,  KURITA, Shinichi ,  WHITE, John M. ,  SORENSEN, Carl A. ,  KHO, Jeffrey A. ,  ANWAR, Suhail ,  FURUTA, Gaku ,  INAGAWA, Makoto

Inventor： CHOI, Soo Young ,  TINER, Robin L. ,  KURITA, Shinichi ,  WHITE, John M. ,  SORENSEN, Carl A. ,  KHO, Jeffrey A. ,  ANWAR, Suhail ,  FURUTA, Gaku ,  INAGAWA, Makoto

IPC: H05H1/34 ,  H01L21/205

CPC classification number: C23C16/5096 ,  C23C16/4585 ,  H01J37/32091 ,  H01J37/32174 ,  H01J37/32568 ,  H01L21/67069

Abstract: A method and apparatus for providing an electrically symmetrical ground or return path for electrical current between two electrodes is described. The apparatus includes at least on radio frequency (RF) device coupled to one of the electrodes and between a sidewall and/or a bottom of a processing chamber. The method includes moving one electrode relative to another and realizing a ground return path based on the position of the displaced electrode using one or both of a RF device coupled to a sidewall and the electrode, a RF device coupled to a bottom of the chamber and the electrode, or a combination thereof.

Abstract translation: 描述了用于为两个电极之间的电流提供电对称接地或返回路径的方法和设备。 该装置包括至少一个射频（RF）装置，该射频（RF）装置耦合到电极中的一个并且位于处理室的侧壁和/或底部之间。 该方法包括使用一个电极相对于另一个电极移动，并且使用耦合到侧壁和电极的RF装置，耦合到腔室底部的RF装置以及耦合到侧壁和电极的RF装置中的一个或两个，基于位移电极的位置实现接地返回路径， 电极或其组合。