LEAD-FREE SOLDER
    1.
    发明申请
    LEAD-FREE SOLDER 审中-公开
    无铅焊枪

    公开(公告)号:WO1997012719A1

    公开(公告)日:1997-04-10

    申请号:PCT/JP1996002774

    申请日:1996-09-26

    CPC classification number: B23K35/262

    Abstract: A low-melting lead-free solder suitable for soldering electronic parts, comprising at least one of 7-10 wt.% Zn, 0.01-1 wt.% Ni, 0.1-3.5 wt.% Ag and 0.1-3 wt.% Cu, and an arbitrary additive of at least one of 0.2-6 wt.% Bi, 0.5-3 wt.% In and 0.001-1 wt.% P, with Sn for the rest. Alternatively, the lead-free solder substantially comprises 2-10 wt.% Zn, 10-30 wt.% Bi, and 0.05-2 wt.% Ag, and an arbitrary additive of 0.001-1 wt.% P, with Sn for the rest. These solders have a tensile strength of not lower than 10 kgf/mm and an elongation of not less than 10 %.

    Abstract translation: 适用于焊接电子部件的低熔点无铅焊料,其包含7-10重量%的Zn,0.01-1重量%的Ni,0.1-3.5重量%的Ag和0.1-3重量%的Cu中的至少一种 ,和0.2-6重量%Bi,0.5-3重量%In和0.001-1重量%P中的至少一种的任意添加剂,其余为Sn。 或者,无铅焊料基本上包括2-10重量%的Zn,10-30重量%的Bi和0.05-2重量%的Ag,以及0.001-1重量%的P的任意的添加剂,Sn用于 其余的部分。 这些焊料的拉伸强度不低于10kgf / mm 2,伸长率不低于10%。

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