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公开(公告)号:WO1997012719A1
公开(公告)日:1997-04-10
申请号:PCT/JP1996002774
申请日:1996-09-26
Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. , SENJU METAL INDUSTRY CO., LTD. , MURATA, Toshikazu , NOGUCHI, Hiroji , KISHIDA, Sadao , TAGUCHI, Toshihiko , ASANO, Shozo , OISHI, Ryo , HORI, Takashi
IPC: B23K35/26
CPC classification number: B23K35/262
Abstract: A low-melting lead-free solder suitable for soldering electronic parts, comprising at least one of 7-10 wt.% Zn, 0.01-1 wt.% Ni, 0.1-3.5 wt.% Ag and 0.1-3 wt.% Cu, and an arbitrary additive of at least one of 0.2-6 wt.% Bi, 0.5-3 wt.% In and 0.001-1 wt.% P, with Sn for the rest. Alternatively, the lead-free solder substantially comprises 2-10 wt.% Zn, 10-30 wt.% Bi, and 0.05-2 wt.% Ag, and an arbitrary additive of 0.001-1 wt.% P, with Sn for the rest. These solders have a tensile strength of not lower than 10 kgf/mm and an elongation of not less than 10 %.
Abstract translation: 适用于焊接电子部件的低熔点无铅焊料,其包含7-10重量%的Zn,0.01-1重量%的Ni,0.1-3.5重量%的Ag和0.1-3重量%的Cu中的至少一种 ,和0.2-6重量%Bi,0.5-3重量%In和0.001-1重量%P中的至少一种的任意添加剂,其余为Sn。 或者,无铅焊料基本上包括2-10重量%的Zn,10-30重量%的Bi和0.05-2重量%的Ag,以及0.001-1重量%的P的任意的添加剂,Sn用于 其余的部分。 这些焊料的拉伸强度不低于10kgf / mm 2,伸长率不低于10%。
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公开(公告)号:WO1986003331A1
公开(公告)日:1986-06-05
申请号:PCT/JP1985000643
申请日:1985-11-19
Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. , MURATA, Toshikazu , TAKESAKO, Yoshinobu , TAKAHASHI, Masayuki
Inventor: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
IPC: H01J29/04
CPC classification number: H01J29/028 , H01J29/04 , H01J31/126 , H01J2329/863 , H01J2329/864 , H01J2329/8645 , H01J2329/8655
Abstract: A plate-like electron gun of a picture display device which utilizes the emission of thermions and which is used in the field of video information instruments. An electrode on the back of the electron gun comprises a plate-like back electrode (12) which has a conductive film (12a) formed on the surface thereof and which is disposed maintaining a predetermined distance from a plurality of line cathodes (2), and a plurality of spacers (13) that are arranged among said plurality of line cathodes (2), that are secured to said back electrode (12) at the ends on one side, and that have a conductive film (13a) formed on the surfaces thereof. This structure enables the electron gun to be easily manufactured. Further, electric charges are prevented from generating, the electric field is stabilized, and no variance develops in the brightness on the anode surface.
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