公开(公告)号：WO2006012090A1

公开(公告)日：2006-02-02

申请号：PCT/US2005/021773

申请日：2005-06-21

Applicant: MOLEX INCORPORATED ,  ZADEREJ, Victor ,  NEUMANN, Michael, J.

Inventor： ZADEREJ, Victor ,  NEUMANN, Michael, J.

IPC: G06F1/16

CPC classification number: H04M1/0216 ,  G06F1/1616 ,  G06F1/1681 ,  G06F1/1683 ,  H01R35/025 ,  H05K1/118 ,  H05K1/147 ,  H05K5/0226 ,  Y10T16/53615

Abstract: A hinge for an electronic device is provided. The electronic device has a first half and a second half. The hinge includes a rigid, multi-layer printed wiring board capable of being electrically coupled to the first half of the electronic device, and a flexible circuit electrically connected to the printed wiring board and capable of being electrically coupled to the second half of the electronic device. The printed wiring board is fixed relative to the first half. When the second half of the electronic device is moved relative to the first half, the flexible circuit winds and unwinds.

Abstract translation: 提供了一种用于电子设备的铰链。 电子设备具有前半部分和后半部分。 铰链包括能够电耦合到电子设备的前半部分的刚性多层印刷线路板，以及电连接到印刷线路板并且能够电耦合到电子器件的第二半部分的柔性电路 设备。 印刷电路板相对于前半部分固定。 当电子设备的第二半相对于前半部分移动时，柔性电路卷绕并展开。

公开(公告)号：WO2011063105A3

公开(公告)日：2011-08-18

申请号：PCT/US2010057205

申请日：2010-11-18

Applicant: MOLEX INC ,  BRUNKER DAVID L ,  DUNHAM DAVID E ,  REGNIER KENT E ,  NEUMANN MICHAEL J

Inventor： BRUNKER DAVID L ,  DUNHAM DAVID E ,  REGNIER KENT E ,  NEUMANN MICHAEL J

IPC: H05K1/14 ,  H05K3/40

CPC classification number: H05K1/115 ,  H05K1/0219 ,  H05K1/024 ,  H05K1/0245 ,  H05K1/0251 ,  H05K2201/09063 ,  H05K2201/09618 ,  H05K2201/09636

Abstract: A circuit board includes a first and second ground layer and a plurality of signal vias extending between the ground layers but not electrical contact therewith. Ground vias coupled to the first and second ground layers can be positioned adjacent signal vias and can include ground traces that extend between adjacent ground vias. Air holes can be positioned between signal vias and/or adjacent signal vias to modify the electrical performance of the circuit board. Ground wings can be used to help tune common-mode and/or differential-mode impedances.

Abstract translation: 电路板包括第一和第二接地层以及在接地层之间延伸但不与其接触的多个信号通孔。 耦合到第一和第二接地层的接地通孔可以位于信号通孔附近，并且可以包括在相邻的接地通孔之间延伸的接地迹线。 气孔可以位于信号通道和/或相邻信号通道之间，以改变电路板的电气性能。 地面翼可用于帮助调谐共模和/或差模阻抗。

公开(公告)号：WO2011063105A2

公开(公告)日：2011-05-26

申请号：PCT/US2010/057205

申请日：2010-11-18

Applicant: MOLEX INCORPORATED ,  BRUNKER, David, L. ,  DUNHAM, David, E. ,  REGNIER, Kent, E. ,  NEUMANN, Michael, J.

Inventor： BRUNKER, David, L. ,  DUNHAM, David, E. ,  REGNIER, Kent, E. ,  NEUMANN, Michael, J.

IPC: H05K1/14 ,  H05K3/40

CPC classification number: H05K1/115 ,  H05K1/0219 ,  H05K1/024 ,  H05K1/0245 ,  H05K1/0251 ,  H05K2201/09063 ,  H05K2201/09618 ,  H05K2201/09636

Abstract: A circuit board includes a first and second ground layer and a plurality of signal vias extending between the ground layers but not electrical contact therewith. Ground vias coupled to the first and second ground layers can be positioned adjacent signal vias and can include ground traces that extend between adjacent ground vias. Air holes can be positioned between signal vias and/or adjacent signal vias to modify the electrical performance of the circuit board. Ground wings can be used to help tune common-mode and/or differential-mode impedances.

Abstract translation: 电路板包括第一和第二接地层以及在接地层之间延伸但不与其电接触的多个信号通孔。 耦合到第一和第二接地层的接地通孔可以位于信号过孔附近并且可以包括在相邻接地过孔之间延伸的接地迹线。 气孔可以位于信号过孔和/或相邻的信号过孔之间，以改变电路板的电气性能。 地面机翼可用于帮助调整共模和/或差模阻抗。